ORCID Profile
0000-0002-4088-4256
Current Organisations
UNIVERSITA' DEGLI STUDI DI PARMA
,
Charité Universitätsmedizin Berlin
,
University of New South Wales
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In Research Link Australia (RLA), "Research Topics" refer to ANZSRC FOR and SEO codes. These topics are either sourced from ANZSRC FOR and SEO codes listed in researchers' related grants or generated by a large language model (LLM) based on their publications.
Microelectronics and Integrated Circuits | Microelectromechanical Systems (MEMS) | Electrical and Electronic Engineering | Compound Semiconductors | Mechanical Engineering |
Integrated Circuits and Devices | Integrated Systems | Industrial Instruments | Expanding Knowledge in Technology
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2008
Publisher: SPIE
Date: 02-04-2004
DOI: 10.1117/12.523272
Publisher: SPIE
Date: 22-12-2015
DOI: 10.1117/12.2202494
Publisher: Elsevier BV
Date: 06-2007
Publisher: SPIE
Date: 26-12-2008
DOI: 10.1117/12.810451
Publisher: Elsevier BV
Date: 04-2007
Publisher: Elsevier BV
Date: 05-2012
Publisher: SPIE-Intl Soc Optical Eng
Date: 08-07-2016
Publisher: IEEE
Date: 06-2019
Publisher: Elsevier BV
Date: 2011
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2019
Publisher: IOP Publishing
Date: 18-07-2017
Abstract: In this paper, we demonstrate a novel low temperature nanofabrication approach that enables the formation of ultra-sharp high aspect ratio (HAR) and high density nanotip structures and their integration onto nanoscale cantilever beams. The nanotip structure consists of a nanoscale thermally evaporated Cr Spindt tip on top of an amorphous silicon rod. An apex radius of the tip, as small as 2.5 nm, has been achieved, and is significantly smaller than any other Spindt tips reported so far. 100 nm wide tips with aspect ratio of more than 50 and tip density of more than 5 × 10
Publisher: IEEE
Date: 10-2006
Publisher: Springer Science and Business Media LLC
Date: 03-2018
Publisher: Elsevier BV
Date: 2012
Publisher: Institution of Engineering and Technology (IET)
Date: 2006
DOI: 10.1049/EL:20064434
Publisher: MIT Press - Journals
Date: 2019
DOI: 10.1162/NETN_A_00062
Abstract: In the past two decades, functional Magnetic Resonance Imaging (fMRI) has been used to relate neuronal network activity to cognitive processing and behavior. Recently this approach has been augmented by algorithms that allow us to infer causal links between component populations of neuronal networks. Multiple inference procedures have been proposed to approach this research question but so far, each method has limitations when it comes to establishing whole-brain connectivity patterns. In this paper, we discuss eight ways to infer causality in fMRI research: Bayesian Nets, Dynamical Causal Modelling, Granger Causality, Likelihood Ratios, Linear Non-Gaussian Acyclic Models, Patel’s Tau, Structural Equation Modelling, and Transfer Entropy. We finish with formulating some recommendations for the future directions in this area.
Publisher: IEEE
Date: 2019
Publisher: IEEE
Date: 06-2013
Publisher: Institution of Engineering and Technology (IET)
Date: 09-2017
DOI: 10.1049/EL.2017.2714
Publisher: SPIE
Date: 02-04-2004
DOI: 10.1117/12.522893
Publisher: Elsevier BV
Date: 2014
Publisher: Elsevier BV
Date: 06-2012
Publisher: Springer Science and Business Media LLC
Date: 20-05-2020
DOI: 10.1038/S41528-020-0072-2
Abstract: This work demonstrates the application of electrospun single and bundled carbon nanofibers (CNFs) as piezoresistive sensing elements in flexible and ultralightweight sensors. Material, electrical, and nanomechanical characterizations were conducted on the CNFs to understand the effect of the critical synthesis parameter—the pyrolyzation temperature on the morphological, structural, and electrical properties. The mechanism of conductive path change under the influence of external stress was hypothesized to explain the piezoresistive behavior observed in the CNF bundles. Quasi-static tensile strain characterization of the CNF bundle-based flexible strain sensor showed a linear response with an average gauge factor of 11.14 (for tensile strains up to 50%). Furthermore, conductive graphitic domain discontinuity model was invoked to explain the piezoresistivity originating in a single isolated electrospun CNF. Finally, a single piezoresistive CNF was utilized as a sensing element in an NEMS flow sensor to demonstrate air flow sensing in the range of 5–35 m/s.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2016
Publisher: SPIE
Date: 21-12-2008
DOI: 10.1117/12.759340
Publisher: SPIE
Date: 21-12-2008
DOI: 10.1117/12.759343
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2022
Publisher: SPIE
Date: 22-12-2015
DOI: 10.1117/12.2202502
Publisher: SPIE
Date: 28-02-2005
DOI: 10.1117/12.582396
Publisher: IOP Publishing
Date: 25-08-2006
Publisher: Elsevier BV
Date: 2016
Publisher: IEEE
Date: 06-2015
Publisher: Elsevier BV
Date: 2010
Publisher: IEEE
Date: 06-2017
Publisher: SPIE
Date: 07-12-2013
DOI: 10.1117/12.2033715
Publisher: Institution of Engineering and Technology (IET)
Date: 2012
DOI: 10.1049/EL.2012.0754
Publisher: Institution of Engineering and Technology (IET)
Date: 2010
DOI: 10.1049/EL.2010.1914
Publisher: Elsevier BV
Date: 09-2009
Publisher: IEEE
Date: 04-2018
Publisher: Elsevier BV
Date: 12-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2013
Publisher: IEEE
Date: 04-2018
Publisher: Elsevier BV
Date: 2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2018
Publisher: Elsevier BV
Date: 03-2011
Publisher: IEEE
Date: 2005
Publisher: Elsevier BV
Date: 2014
Publisher: Elsevier BV
Date: 03-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-08-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-05-2023
Publisher: IEEE
Date: 2018
Publisher: SPIE
Date: 28-02-2005
DOI: 10.1117/12.582405
Publisher: SPIE
Date: 28-02-2015
DOI: 10.1117/12.582404
Start Date: 07-2021
End Date: 07-2022
Amount: $527,638.00
Funder: Australian Research Council
View Funded ActivityStart Date: 10-2022
End Date: 10-2024
Amount: $580,000.00
Funder: Australian Research Council
View Funded Activity