ORCID Profile
0000-0003-3406-0290
Current Organisation
University of Science and Technology Beijing
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Publisher: Elsevier BV
Date: 2017
Publisher: Elsevier BV
Date: 2020
Publisher: Elsevier BV
Date: 09-2017
Publisher: Elsevier BV
Date: 10-2018
Publisher: Elsevier BV
Date: 08-2018
Publisher: Elsevier BV
Date: 06-2021
Publisher: Trans Tech Publications, Ltd.
Date: 07-2016
DOI: 10.4028/WWW.SCIENTIFIC.NET/MSF.861.3
Abstract: Single crystal silicon carbide (SiC) is a new semiconductor material that has a great potential to be widely used. However, SiC is a kind of difficult-to-machine material due to its extreme hardness and brittleness. The present study investigated the machinability of single crystal SiC using dry laser and three different water-laser co-machining processes. The results indicate that using the hybrid laser-waterjet micro-machining to micro-groove single crystal SiC can derive the clean and straight edges and thermal damage-free grooves.
Publisher: Elsevier BV
Date: 12-2020
Publisher: Elsevier BV
Date: 2024
Publisher: Informa UK Limited
Date: 10-03-2021
Publisher: Elsevier BV
Date: 04-2019
Publisher: Elsevier BV
Date: 2021
Start Date: 2021
End Date: 2022
Funder: Beijing Natural Science Foundation
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