ORCID Profile
0000-0002-1724-5667
Current Organisations
Flinders University
,
Macquarie University
,
University of New South Wales
,
Griffith University
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Research Topics
In Research Link Australia (RLA), "Research Topics" refer to ANZSRC FOR and SEO codes. These topics are either sourced from ANZSRC FOR and SEO codes listed in researchers' related grants or generated by a large language model (LLM) based on their publications.
Top 5 Research Topics
ANZSRC Field of Research (FoR)
Sensor Technology (Chemical aspects) | Microelectromechanical Systems (MEMS) | Agricultural Biotechnology | Nanomaterials | Mechanical engineering | Medical Devices | Nanotechnology | Mechanical Engineering | Agricultural Biotechnology Diagnostics (incl. Biosensors) | Microelectromechanical systems (MEMS) |
ANZSRC Socio-Economic Objective (SEO)
Sugar | Diagnostic Methods | Pipeline Transport | Expanding Knowledge in the Physical Sciences | Integrated Circuits and Devices | Expanding Knowledge in the Agricultural and Veterinary Sciences | Health Status (e.g. Indicators of Well-Being) | Expanding Knowledge in Technology |
Related Links
Publications
Mesoporous gold–silver alloy films towards amplification-free ultra-sensitive microRNA detection
Publisher: Royal Society of Chemistry (RSC)
Date: 2020
DOI: 10.1039/D0TB02003F
Abstract: The fabrication of a bimetallic mesoporous Au–Ag biosensor for achieving attomolar sensitive detection of magnetically purified target miRNA without any lification or enzymatic process is reported.
Thermal Flow Sensors for Harsh Environments
Publisher: MDPI AG
Date: 14-07-2017
DOI: 10.20944/PREPRINTS201707.0031.V1
Abstract: Flow sensing in hostile environment is of increasing interest for applications in automotive, aerospace, and chemical and resource industries. Compared to their counterparts, thermal flow sensors are attractive candidates due to the ease of fabrication, lack of moving parts and higher sensitivity. Recently, a number of thermal flow sensor prototypes have been reported in the literature demonstrating the measurement of fluid flows under hostile conditions. This paper summarizes the concept of thermal flow sensing, operational modes and transduction mechanisms. Then, the choice of materials and their corresponding properties are presented in details. The paper also reports recent progress in the development of thermal flow sensors for harsh environment. In addition, the issues and considerations in packaging are reviewed. Finally, we conclude the review with the future prospects.
Influence of gallium ion beam acceleration voltage on the bend angle of amorphous silicon cantilevers
Publisher: IOP Publishing
Date: 11-05-2016
Abstract: This paper describes a plastic reshaping technique for Si thin membranes by using focused ion beam (FIB) processing. FIB is used to locally pattern and implant Ga ions into the membranes. The combination of Ga ion doping and alkali wet etching enables us to fabricate nanometer-thick Ga-ion-doped amorphous Si membranes, which can be bent upward at arbitrary angle by controlling the FIB beam irradiation condition. The bending mechanism is discussed in the light of Ga ions implanted depth from the membrane surface. By using this technique, a micrometer-sized chute structure with several different angles is produced.
Enhanced Electrohydrodynamics for Electrospinning a Highly Sensitive Flexible Fiber-Based Piezoelectric Sensor
Publisher: American Chemical Society (ACS)
Date: 07-03-2022
Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure
Publisher: Elsevier BV
Date: 10-2018
Paper-Based Electronics Using Graphite and Silver Nanoparticles for Respiration Monitoring
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-12-2019
Engineering Route for Stretchable, 3D Microarchitectures of Wide Bandgap Semiconductors for Biomedical Applications
Publisher: Wiley
Date: 05-05-2023
Abstract: Wide bandgap (WBG) semiconductors have attracted significant research interest for the development of a broad range of flexible electronic applications, including wearable sensors, soft logical circuits, and long‐term implanted neuromodulators. Conventionally, these materials are grown on standard silicon substrates, and then transferred onto soft polymers using mechanical st ing processes. This technique can retain the excellent electrical properties of wide bandgap materials after transfer and enables flexibility however, most devices are constrained by 2D configurations that exhibit limited mechanical stretchability and morphologies compared with 3D biological systems. Herein, a st ing‐free micromachining process is presented to realize, for the first time, 3D flexible and stretchable wide bandgap electronics. The approach applies photolithography on both sides of free‐standing nanomembranes, which enables the formation of flexible architectures directly on standard silicon wafers to tailor the optical transparency and mechanical properties of the material. Subsequent detachment of the flexible devices from the support substrate and controlled mechanical buckling transforms the 2D precursors of wide band gap semiconductors into complex 3D mesoscale structures. The ability to fabricate wide band gap materials with 3D architectures that offer device‐level stretchability combined with their multi‐modal sensing capability will greatly facilitate the establishment of advanced 3D bio‐electronics interfaces.
A Generalized Analytical Model for Joule Heating of Segmented Wires
Publisher: ASME International
Date: 30-03-2018
DOI: 10.1115/1.4038829
Abstract: This paper presents an analytical solution for the Joule heating problem of a segmented wire made of two materials with different properties and suspended as a bridge across two fixed ends. The paper first establishes the one-dimensional (1D) governing equations of the steady-state temperature distribution along the wire with the consideration of heat conduction and free-heat convection phenomena. The temperature coefficient of resistance of the constructing materials and the dimension of the each segmented wires were also taken into account to obtain analytical solution of the temperature. COMSOL numerical solutions were also obtained for initial validation. Experimental studies were carried out using copper and nichrome wires, where the temperature distribution was monitored using an IR thermal camera. The data showed a good agreement between experimental data and the analytical data, validating our model for the design and development of thermal sensors based on multisegmented structures.
Low-cost multifunctional ionic liquid pressure and temperature sensor
Publisher: Springer International Publishing
Date: 12-2019
Excellent Rectifying Properties of the n-3C-SiC/p-Si Heterojunction Subjected to High Temperature Annealing for Electronics, MEMS, and LED Applications
Publisher: Springer Science and Business Media LLC
Date: 18-12-2017
DOI: 10.1038/S41598-017-17985-9
Abstract: This work examines the stability of epitaxial 3C-SiC/Si heterojunctions subjected to heat treatments between 1000 °C and 1300 °C. Because of the potential for silicon carbide in high temperature and harsh environment applications, and the economic advantages of growing the 3C-SiC polytype on large diameter silicon wafers, its stability after high temperature processing is an important consideration. Yet recently, this has been thrown into question by claims that the heterojunction suffers catastrophic degradation at temperatures above 1000 °C. Here we present results showing that the heterojunction maintains excellent diode characteristics following heat treatment up to 1100 °C and while some changes were observed between 1100 °C and 1300 °C, diodes maintained their rectifying characteristics, enabling compatibility with a large range of device fabrication. The parameters of as-grown diodes were J 0 = 1 × 10 −11 A/mm 2 , n = 1.02, and +/−2V rectification ratio of 9 × 10 6 . Capacitance and thermal current-voltage analysis was used to characterize the excess current leakage mechanism. The change in diode characteristics depends on diode area, with larger areas (1 mm 2 ) having reduced rectification ratio while smaller areas (0.04 mm 2 ) maintained excellent characteristics of J 0 = 2 × 10 −10 A/mm 2 , n = 1.28, and +/−2V ratio of 3 × 10 6 . This points to localized defect regions degrading after heat treatment rather than a fundamental issue of the heterojunction.
Low-Cost Graphite on Paper Pressure Sensor for a Robot Gripper with a Trivial Fabrication Process
Publisher: MDPI AG
Date: 10-2018
DOI: 10.3390/S18103300
Abstract: A flexible pressure sensor with a rudimentary, ultra-low cost, and solvent-free fabrication process is presented in this paper. The sensor has a graphite-on-paper stacked paper structure, which deforms and restores its shape when pressure is applied and released, showing an exceptionally fast response and relaxation time of ≈0.4 ms with a sensitivity of −5%/Pa. Repeatability of the sensor over 1000 cycles indicates an excellent long-term stability. The sensor demonstrated fast and reliable human touch interface, and successfully integrated into a robot gripper to detect grasping forces, showing high promise for use in robotics, human interface, and touch devices.
Sensitive and fast response graphite pressure sensor fabricated by a solvent-free approach
Publisher: IEEE
Date: 10-2017
Ultraviolet and visible photodetection using 3C-SiC/Si hetero-epitaxial junction
Publisher: Springer International Publishing
Date: 12-2019
Carbon nanotube four-terminal devices for pressure sensing applications
Publisher: Springer International Publishing
Date: 12-2019
A new structure of Tesla coupled nozzle in synthetic jet micro-pump
Publisher: Elsevier BV
Date: 11-2020
Photoresponse of a Highly-Rectifying 3C-SiC/Si Heterostructure Under UV and Visible Illuminations
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2018
Transparent Pneumatic Tactile Sensors for Soft Biomedical Robotics
Publisher: MDPI AG
Date: 17-06-2023
DOI: 10.3390/S23125671
Abstract: Palpation is a simple but effective method to distinguish tumors from healthy tissues. The development of miniaturized tactile sensors embedded on endoscopic or robotic devices is key to achieving precise palpation diagnosis and subsequent timely treatment. This paper reports on the fabrication and characterization of a novel tactile sensor with mechanical flexibility and optical transparency that can be easily mounted on soft surgical endoscopes and robotics. By utilizing the pneumatic sensing mechanism, the sensor offers a high sensitivity of 1.25 mbar and negligible hysteresis, enabling the detection of phantom tissues with different stiffnesses ranging from 0 to 2.5 MPa. Our configuration, combining pneumatic sensing and hydraulic actuating, also eliminates electrical wiring from the functional elements located at the robot end-effector, thereby enhancing the system safety. The optical transparency path in the sensors together with its mechanical sensing capability open interesting possibilities in the early detection of solid tumor as well as in the development of all-in-one soft surgical robots that can perform visual/mechanical feedback and optical therapy.
Size-tuneable isolation of cancer cells using stretchable inertial microfluidics
Publisher: Royal Society of Chemistry (RSC)
Date: 2021
DOI: 10.1039/D1LC00082A
Abstract: We present a stretchable inertial microfluidic device for tuneable separation of spiked cancer cells from blood s le.
Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures
Publisher: Royal Society of Chemistry (RSC)
Date: 2018
DOI: 10.1039/C8RA05797D
Abstract: The piezoresistance in crystalline 3C-SiC epitaxially grown on Si was investigated at low temperatures down to 150 K. The large gauge factor in 3C-SiC indicates its feasibility for sensing applications in cryogenic environments.
Flexible and Wearable Flow Sensor Using Spinnable Carbon Nanotube Nanofilm for Respiration Monitoring
Publisher: IEEE
Date: 2020
Integrated, Transparent Silicon Carbide Electronics and Sensors for Radio Frequency Biomedical Therapy
Publisher: American Chemical Society (ACS)
Date: 11-07-2022
Naked-eye and electrochemical detection of isothermally amplified HOTAIR long non-coding RNA
Publisher: Royal Society of Chemistry (RSC)
Date: 2018
DOI: 10.1039/C7AN02109G
Abstract: A naked-eye, colorimetric and electrochemical detection of HOTAIR long non-coding RNA has been demonstrated.
Stretchable respiration sensors: Advanced designs and multifunctional platforms for wearable physiological monitoring
Publisher: Elsevier BV
Date: 10-2020
Squeezing in lithium niobate waveguides
Publisher: SPIE
Date: 30-12-2019
DOI: 10.1117/12.2539899
High-temperature tolerance of the piezoresistive effect in p-4H-SiC for harsh environment sensing
Publisher: Royal Society of Chemistry (RSC)
Date: 2018
DOI: 10.1039/C8TC03094D
Abstract: 4H-silicon carbide based sensors are promising candidates for replacing prevalent silicon-based counterparts in harsh environments owing to their superior chemical inertness, high stability and reliability.
Highly-doped SiC resonator with ultra-large tuning frequency range by Joule heating effect
Publisher: Elsevier BV
Date: 09-2020
Stretchable Inertial Microfluidic Device for Tunable Particle Separation
Publisher: American Chemical Society (ACS)
Date: 06-08-2020
Isotropic piezoresistance of p-type 4H-SiC in (0001) plane
Publisher: AIP Publishing
Date: 02-07-2018
DOI: 10.1063/1.5037545
Abstract: In this work, the isotropic piezoresistance in the (0001) plane of p-type 4H-SiC was discovered by means of the hole energy shift calculation and the coordinate transformation. These results were also confirmed by the measurement of the piezoresistance using a bending beam method. The fundamental longitudinal and transverse piezoresistive coefficients π11 and π12 were found to be 6.43 × 10−11 Pa−1 and −5.12 × 10−11 Pa−1, respectively. The isotropy of the piezoresistance in the basal plane of p-type 4H-SiC is attributed to the isotropic hole energy shift under uniaxial strain. This interesting phenomenon in p-type 4H-SiC is promising for the design and fabrication of mechanical sensors and strain-engineered electronics since high sensitivity and consistent performance can be achieved regardless of the crystallographic orientation.
Ultra-Sensitive OPTO-Piezoresistive Sensors Utilising 3C-SiC/Si Heterostructures
Publisher: IEEE
Date: 06-2019
A hot-film air flow sensor for elevated temperatures
Publisher: AIP Publishing
Date: 2019
DOI: 10.1063/1.5065420
Abstract: We report a novel packaging and experimental technique for characterizing thermal flow sensors at high temperatures. This paper first reports the fabrication of 3C-SiC (silicon carbide) on a glass substrate via anodic bonding, followed by the investigation of thermoresistive and Joule heating effects in the 3C-SiC nano-thin film heater. The high thermal coefficient of resistance of approximately −20 720 ppm/K at ambient temperature and −9287 ppm/K at 200 °C suggests the potential use of silicon carbide for thermal sensing applications in harsh environments. During the Joule heating test, a high-temperature epoxy and a brass metal sheet were utilized to establish the electric conduction between the metal electrodes and SiC heater inside a temperature oven. In addition, the metal wires from the sensor to the external circuitry were protected by a fiberglass insulating sheath to avoid short circuit. The Joule heating test ensured the stability of mechanical and Ohmic contacts at elevated temperatures. Using a hot-wire anemometer as a reference flow sensor, calibration tests were performed at 25 °C, 35 °C, and 45 °C. Then, the SiC hot-film sensor was characterized for a range of low air flow velocity, indicating a sensitivity of 5 mm−1 s. The air flow was established by driving a metal propeller connected to a DC motor and controlled by a microcontroller. The materials, metallization, and interconnects used in our flow sensor were robust and survived temperatures of around 200 °C.
Novel Low-Cost Sensor for Human Bite Force Measurement
Publisher: MDPI AG
Date: 06-08-2016
DOI: 10.3390/S16081244
Piezotronic effect in a normally off p-GaN/AlGaN/GaN HEMT toward highly sensitive pressure sensor
Publisher: AIP Publishing
Date: 14-06-2021
DOI: 10.1063/5.0053701
Abstract: We report the effect of stress or strain on the electronic characteristics of a normally off AlGaN/GaN high electron mobility transistor (HEMT) and demonstrate its role as a highly sensitive pressure sensor. We observe that the HEMT drain current exhibits a linear change of 2.5%/bar upon the application of pressure, which is translated to a strain sensitivity of 1250 ppm−1. This is the highest strain sensitivity ever reported on HEMTs and many other conventional strain sensing configurations. The relative change of drain current is largest when the gate bias is near-threshold and drain bias is slightly larger than the saturation bias. The electron sheet density and mobility changes in the AlGaN/GaN heterointerface under the applied pressure or mechanical strain are explained qualitatively. The spontaneous and piezoelectric-polarization-induced surface and interface charges in the AlGaN/GaN heterojunction can be used to develop very sensitive and robust pressure sensors. The results demonstrate a considerable potential of normally off AlGaN/GaN HEMTs for highly sensitive and reliable mechanical sensing applications with low energy consumption.
The Piezoresistive Effect of SiC for MEMS Sensors at High Temperatures: A Review
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2015
Robust Free-Standing Nano-Thin SiC Membranes Enable Direct Photolithography for MEMS Sensing Applications
Publisher: Wiley
Date: 15-12-2018
High temperature silicon-carbide-based flexible electronics for monitoring hazardous environments
Publisher: Elsevier BV
Date: 07-2020
Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications
Publisher: American Chemical Society (ACS)
Date: 15-08-2017
Abstract: Single-crystal cubic silicon carbide has attracted great attention for MEMS and electronic devices. However, current leakage at the SiC/Si junction at high temperatures and visible-light absorption of the Si substrate are main obstacles hindering the use of the platform in a broad range of applications. To solve these bottlenecks, we present a new platform of single crystal SiC on an electrically insulating and transparent substrate using an anodic bonding process. The SiC thin film was prepared on a 150 mm Si with a surface roughness of 7 nm using LPCVD. The SiC/Si wafer was bonded to a glass substrate and then the Si layer was completely removed through wafer polishing and wet etching. The bonded SiC/glass s les show a sharp bonding interface of less than 15 nm characterized using deep profile X-ray photoelectron spectroscopy, a strong bonding strength of approximately 20 MPa measured from the pulling test, and relatively high optical transparency in the visible range. The transferred SiC film also exhibited good conductivity and a relatively high temperature coefficient of resistance varying from -12 000 to -20 000 ppm/K, which is desirable for thermal sensors. The biocompatibility of SiC/glass was also confirmed through mouse 3T3 fibroblasts cell-culturing experiments. Taking advantage of the superior electrical properties and biocompatibility of SiC, the developed SiC-on-glass platform offers unprecedented potentials for high-temperature electronics as well as bioapplications.
Advances in ultrasensitive piezoresistive sensors: from conventional to flexible and stretchable applications
Publisher: Royal Society of Chemistry (RSC)
Date: 2021
DOI: 10.1039/D1MH00538C
Abstract: This paper comprehensively reviews methods and approaches to enhance the piezoresistive effect, ranging from the quantum physical effect and new materials to nanoscopic and macroscopic structures, and from conventional rigid to soft electronic applications.
A Versatile Sacrificial Layer for Transfer Printing of Wide Bandgap Materials for Implantable and Stretchable Bioelectronics
Publisher: Wiley
Date: 04-09-2020
Strain Effect in Highly‐Doped n‐Type 3C‐SiC‐on‐Glass Substrate for Mechanical Sensors and Mobility Enhancement
Publisher: Wiley
Date: 22-07-2018
Unintentionally Doped Epitaxial 3C-SiC(111) Nanothin Film as Material for Highly Sensitive Thermal Sensors at High Temperatures
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2018
Highly sensitive p-type 4H-SiC van der Pauw sensor
Publisher: Royal Society of Chemistry (RSC)
Date: 2018
DOI: 10.1039/C7RA11922D
Abstract: This paper presents for the first time a p-type 4H silicon carbide (4H-SiC) van der Pauw strain sensor by utilizing the strain induced effect in four-terminal devices.
Ultra-sensitive self-powered position-sensitive detector based on horizontally-aligned double 3C-SiC/Si heterostructures
Publisher: Elsevier BV
Date: 2021
Silicon micro-/nanomachining and applications
Publisher: Springer International Publishing
Date: 29-10-2017
Self-powered monolithic accelerometer using a photonic gate
Publisher: Elsevier BV
Date: 10-2020
Superior Robust Ultrathin Single-Crystalline Silicon Carbide Membrane as a Versatile Platform for Biological Applications
Publisher: American Chemical Society (ACS)
Date: 20-11-2017
Abstract: Micromachined membranes are promising platforms for cell culture thanks to their miniaturization and integration capabilities. Possessing chemical inertness, biocompatibility, and integration, silicon carbide (SiC) membranes have attracted great interest toward biological applications. In this paper, we present the batch fabrication, mechanical characterizations, and cell culture demonstration of robust ultrathin epitaxial deposited SiC membranes. The as-fabricated ultrathin SiC membranes, with an ultrahigh aspect ratio (length/thickness) of up to 20 000, possess high a fracture strength up to 2.95 GPa and deformation up to 50 μm. A high optical transmittance of above 80% at visible wavelengths was obtained for 50 nm membranes. The as-fabricated membranes were experimentally demonstrated as an excellent substrate platform for bio-MEMS/NEMS cell culture with the cell viability rate of more than 92% after 72 h. The ultrathin SiC membrane is promising for in vitro observations/imaging of bio-objects with an extremely short optical access.
Mesoporous Metastable CuTe2 Semiconductor
Publisher: American Chemical Society (ACS)
Date: 18-10-2023
DOI: 10.1021/JACS.3C05846
Enhanced Photovoltaic Effect in n-3C-SiC/p-Si Heterostructure Using a Temperature Gradient for Microsensors
Publisher: American Chemical Society (ACS)
Date: 02-08-2023
Long-Lived, Transferred Crystalline Silicon Carbide Nanomembranes for Implantable Flexible Electronics
Publisher: American Chemical Society (ACS)
Date: 21-08-2019
Abstract: Implantable electronics are of great interest owing to their capability for real-time and continuous recording of cellular-electrical activity. Nevertheless, as such systems involve direct interfaces with surrounding biofluidic environments, maintaining their long-term sustainable operation, without leakage currents or corrosion, is a daunting challenge. Herein, we present a thin, flexible semiconducting material system that offers attractive attributes in this context. The material consists of crystalline cubic silicon carbide nanomembranes grown on silicon wafers, released and then physically transferred to a final device substrate (
Advances in Rational Design and Materials of High‐Performance Stretchable Electromechanical Sensors
Publisher: Wiley
Date: 26-02-2020
Experimental Investigation of Piezoresistive Effect in p-Type 4H–SiC
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2017
Wireless Battery-Free SiC Sensors Operating in Harsh Environments Using Resonant Inductive Coupling
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2019
Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems
Publisher: Wiley
Date: 07-12-2021
Abstract: Transformation of conventional 2D platforms into unusual 3D configurations provides exciting opportunities for sensors, electronics, optical devices, and biological systems. Engineering material properties or controlling and modulating stresses in thin films to pop‐up 3D structures out of standard planar surfaces has been a highly active research topic over the last decade. Implementation of 3D micro and nanoarchitectures enables unprecedented functionalities including multiplexed, monolithic mechanical sensors, vertical integration of electronics components, and recording of neuron activities in 3D organoids. This paper provides an overview on stress engineering approaches to developing 3D functional microsystems. The paper systematically presents the origin of stresses generated in thin films and methods to transform a 2D design into an out‐of‐plane configuration. Different types of 3D micro and nanostructures, along with their applications in several areas are discussed. The paper concludes with current technical challenges and potential approaches and applications of this fast‐growing research direction.
A sensitive liquid-cantilever diaphragm for pressure sensor
Publisher: IEEE
Date: 2013
Highly sensitive 3C-SiC on glass based thermal flow sensor realized using MEMS technology
Publisher: Elsevier BV
Date: 08-2018
Dependence of offset voltage in AlGaN/GaN van der Pauw devices under mechanical strain
Publisher: Elsevier BV
Date: 06-2019
Electrostatically excited liquid marble as a micromixer
Publisher: Royal Society of Chemistry (RSC)
Date: 2021
DOI: 10.1039/D1RE00121C
Abstract: Liquid marble as a micromixer. Particles suspended in a transparent liquid marble is dispersed in a time lapse photo. The colour change from red to purple shows the particle position from the first frame to the last frame.
Liquid Marbles as Miniature Reactors for Chemical and Biological Applications
Publisher: MDPI AG
Date: 07-07-2020
DOI: 10.3390/PR8070793
Abstract: The need for miniaturised reaction systems has led to the development of various microreactor platforms, such as droplet-based microreactors. However, these microreactors possess inherent drawbacks, such as rapid evaporation and difficult handling, that limit their use in practical applications. Liquid marbles are droplets covered with hydrophobic particles and are a potential platform that can overcome the weaknesses of bare droplets. The coating particles completely isolate the interior liquids from the surrounding environment, thus conveniently encapsulating the reactions. Great efforts have been made over the past decade to demonstrate the feasibility of liquid marble-based microreactors for chemical and biological applications. This review systemically summarises state-of-the-art implementations of liquid marbles as microreactors. This paper also discusses the various aspects of liquid marble-based microreactors, such as the formation, manipulation, and future perspectives.
Functional Microarray Platform with Self-Assembled Monolayers on 3C-Silicon Carbide
Publisher: American Chemical Society (ACS)
Date: 26-10-2020
Thermoresistive Effect for Advanced Thermal Sensors: Fundamentals, Design Considerations, and Applications
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2017
Piezoresistive Effect with a Gauge Factor of 18 000 in a Semiconductor Heterojunction Modulated by Bonded Light-Emitting Diodes
Publisher: American Chemical Society (ACS)
Date: 08-07-2021
Thermoresistance of p-Type 4H–SiC Integrated MEMS Devices for High-Temperature Sensing
Publisher: Wiley
Date: 02-01-2019
Lithography and Etching‐Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation
Publisher: Wiley
Date: 06-02-2020
Multi-axis force sensor with dynamic range up to ultrasonic
Publisher: IEEE
Date: 2014
Micro liquid-based thermo-acoustic transmitter for emitting ultrasound in liquid medium
Publisher: IEEE
Date: 2014
Giant Piezotronic Effect by Photoexcitation–Electronic Coupling in a p-GaN/AlGaN/GaN Heterojunction
Publisher: American Chemical Society (ACS)
Date: 08-06-2022
Pushing the Limits of Piezoresistive Effect by Optomechanical Coupling in 3C-SiC/Si Heterostructure
Publisher: American Chemical Society (ACS)
Date: 07-11-2017
Abstract: This letter reports a giant opto-piezoresistive effect in p-3C-SiC -Si heterostructure under visible-light illumination. The p-3C-SiC -Si heterostructure has been fabricated by growing a 390 nm p-type 3C-SiC on a p-type Si substrate using the low pressure chemical vapor deposition (LPCVD) technique. The gauge factor of the heterostructure was found to be 28 under a dark condition however, it significantly increased to about -455 under illumination of 635 nm wavelength at 3.0 mW/cm
Charge-Reduced Particles via Self-Propelled Electrohydrodynamic Atomization for Drug Delivery Applications
Publisher: American Chemical Society (ACS)
Date: 15-06-2023
Digital Imaging‐based Colourimetry for Enzymatic Processes in Transparent Liquid Marbles
Publisher: Wiley
Date: 26-11-2020
Flexible and multifunctional electronics fabricated by a solvent-free and user-friendly method
Publisher: Royal Society of Chemistry (RSC)
Date: 2016
DOI: 10.1039/C6RA14646E
Abstract: Pencil-drawn flexible and multifunctional electronic devices have been proven to show potential for various applications including mass and flow sensors, human-motion detection and wearable thermal therapy.
Active demultiplexing of single photons from a solid-state source
Publisher: Wiley
Date: 11-04-2017
An On-Chip SiC MEMS Device with Integrated Heating, Sensing, and Microfluidic Cooling Systems
Publisher: Wiley
Date: 12-08-2018
Ultra-thin LPCVD silicon carbide membrane: A promising platform for bio-cell culturing
Publisher: IEEE
Date: 2018
Optothermotronic effect as an ultrasensitive thermal sensing technology for solid-state electronics
Publisher: American Association for the Advancement of Science (AAAS)
Date: 29-05-2020
Abstract: Optothermotronics enable a giant temperature coefficient of resistance using optoelectronic modulation of electric potential.
Electrically Stable Carbon Nanotube Yarn Under Tensile Strain
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2017
TEMPERATURE-DEPENDENT TRANSIENT BEHAVIOR OF AlGaN/GaN HIGH ELECTRON MOBILITY PRESSURE SENSORS
Publisher: Transducer Research Foundation
Date: 21-05-2018
Toward on-board microchip synthesis of CdSe: Vs. PbSe nanocrystalline quantum dots as a spectral decoy for protecting space assets
Publisher: Royal Society of Chemistry (RSC)
Date: 2021
DOI: 10.1039/D0RE00327A
Abstract: Fabrication of the reaction chamber using silicon carbide. (A) A schematic sketch of the fabrication flow (B) a photograph of a transparent 6 inch SiC-on-glass wafer (C) the surface morphology of the SiC film.
Nanoarchitectonics for Wide Bandgap Semiconductor Nanowires: Toward the Next Generation of Nanoelectromechanical Systems for Environmental Monitoring
Publisher: Wiley
Date: 24-09-2020
A rapid and cost-effective metallization technique for 3C–SiC MEMS using direct wire bonding
Publisher: Royal Society of Chemistry (RSC)
Date: 2018
DOI: 10.1039/C8RA00734A
Abstract: This paper presents a simple, rapid and cost-effective wire bonding technique for single crystalline silicon carbide (3C–SiC) MEMS devices.
Steady-state analytical model of suspended p-type 3C-SiC bridges under consideration of Joule heating
Publisher: IOP Publishing
Date: 05-06-2017
Wide-Band-Gap Semiconductors for Biointegrated Electronics: Recent Advances and Future Directions
Publisher: American Chemical Society (ACS)
Date: 19-04-2021
Polyacrylonitrile-carbon Nanotube-polyacrylonitrile: A Versatile Robust Platform for Flexible Multifunctional Electronic Devices in Medical Applications
Publisher: Wiley
Date: 19-03-2019
In-air particle generation by on-chip electrohydrodynamics
Publisher: Royal Society of Chemistry (RSC)
Date: 2021
DOI: 10.1039/D0LC01247E
Abstract: This work demonstrates the capability of simultaneously generating-and-delivering a stream of micro/nanoparticles range of 0.75–2 μm by electrohydrodynamics, without any restrictions of either the collector or the assistance of external flow.
Fabrication of a sensitive pressure sensor using carbon nanotube micro-yarns
Publisher: IEEE
Date: 10-2017
Universal Electrochemical Synthesis of Mesoporous Chalcogenide Semiconductors: Mesoporous CdSe and CdTe Thin Films for Optoelectronic Applications
Publisher: Wiley
Date: 17-03-2021
Abstract: Here we report the soft‐template‐assisted electrochemical deposition of mesoporous semiconductors (CdSe and CdTe). The resulting mesoporous films are stoichiometrically equivalent and contain mesopores homogeneously distributed over the entire surface. To demonstrate the versatility of the method, two block copolymers with different molecular weights are used, yielding films with pores of either 9 or 18 nm diameter. As a proof of concept, the mesoporous CdSe film‐based photodetectors show a high sensitivity of 204 mW −1 cm 2 at 680 nm wavelength, which is at least two orders of magnitude more sensitive than the bulk counterpart. This work presents a new synthesis route for nanostructured semiconductors with optical band gaps active in the visible spectrum.
Controllable high-performance liquid marble micromixer
Publisher: Royal Society of Chemistry (RSC)
Date: 2022
DOI: 10.1039/D2LC00017B
Abstract: A high-performance micromixer based on rolling liquid marble.
Avoiding Pre-Isolation Step in Exosome Analysis: Direct Isolation and Sensitive Detection of Exosomes Using Gold-Loaded Nanoporous Ferric Oxide Nanozymes
Publisher: American Chemical Society (ACS)
Date: 08-02-2019
DOI: 10.1021/ACS.ANALCHEM.8B03619
Abstract: Most of the current exosome-analysis strategies are time-consuming and largely dependent on commercial extraction kit-based preisolation step, which requires extensive s le manipulations, costly isolation kits, reagents, tedious procedures, and sophisticated equipment and is prone to bias/artifacts. Herein we introduce a simple method for direct isolation and subsequent detection of a specific population of exosomes using an engineered superparamagnetic material with multifunctional properties, namely, gold-loaded ferric oxide nanocubes (Au-NPFe
Utilizing large hall offset voltage for conversion free 4H-SiC strain sensor
Publisher: IEEE
Date: 2018
Universal Electrochemical Synthesis of Mesoporous Chalcogenide Semiconductors: Mesoporous CdSe and CdTe Thin Films for Optoelectronic Applications
Publisher: Wiley
Date: 17-03-2021
Abstract: Here we report the soft‐template‐assisted electrochemical deposition of mesoporous semiconductors (CdSe and CdTe). The resulting mesoporous films are stoichiometrically equivalent and contain mesopores homogeneously distributed over the entire surface. To demonstrate the versatility of the method, two block copolymers with different molecular weights are used, yielding films with pores of either 9 or 18 nm diameter. As a proof of concept, the mesoporous CdSe film‐based photodetectors show a high sensitivity of 204 mW −1 cm 2 at 680 nm wavelength, which is at least two orders of magnitude more sensitive than the bulk counterpart. This work presents a new synthesis route for nanostructured semiconductors with optical band gaps active in the visible spectrum.
Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures
Publisher: Elsevier BV
Date: 10-2018
A hydrophone using liquid to bridge the gap of a piezo-resistive cantilever
Publisher: IEEE
Date: 06-2013
Transparent crystalline cubic SiC-on-glass electrodes enable simultaneous electrochemistry and optical microscopy
Publisher: Royal Society of Chemistry (RSC)
Date: 2019
DOI: 10.1039/C9CC03082D
Abstract: This work introduces transparent SiC-on-glass as a new platform for biosensing applications which enables cell culturing, stimulating, microscopy-imaging and bioelectrochemical detection.
Flexible microfluidics: Fundamentals, recent developments, and applications
Publisher: MDPI AG
Date: 29-11-2019
DOI: 10.3390/MI10120830
Abstract: Miniaturization has been the driving force of scientific and technological advances over recent decades. Recently, flexibility has gained significant interest, particularly in miniaturization approaches for biomedical devices, wearable sensing technologies, and drug delivery. Flexible microfluidics is an emerging area that impacts upon a range of research areas including chemistry, electronics, biology, and medicine. Various materials with flexibility and stretchability have been used in flexible microfluidics. Flexible microchannels allow for strong fluid-structure interactions. Thus, they behave in a different way from rigid microchannels with fluid passing through them. This unique behaviour introduces new characteristics that can be deployed in microfluidic applications and functions such as valving, pumping, mixing, and separation. To date, a specialised review of flexible microfluidics that considers both the fundamentals and applications is missing in the literature. This review aims to provide a comprehensive summary including: (i) Materials used for fabrication of flexible microfluidics, (ii) basics and roles of flexibility on microfluidic functions, (iii) applications of flexible microfluidics in wearable electronics and biology, and (iv) future perspectives of flexible microfluidics. The review provides researchers and engineers with an extensive and updated understanding of the principles and applications of flexible microfluidics.
Opto-electronic coupling in semiconductors: towards ultrasensitive pressure sensing
Publisher: Royal Society of Chemistry (RSC)
Date: 2020
DOI: 10.1039/D0TC00229A
Abstract: A novel concept of opto-electronic coupling in semiconductor heterojunctions for pressure sensing is proposed. By using non-uniform illumination of visible light coupling with tuning current, performance of the pressure sensor is enormously enhanced.
Implanted Flexible Electronics: Set Device Lifetime with Smart Nanomaterials
Publisher: MDPI AG
Date: 05-02-2021
DOI: 10.3390/MI12020157
Abstract: Flexible electronics is one of the most attractive and anticipated markets in the internet-of-things era, covering a broad range of practical and industrial applications from displays and energy harvesting to health care devices. The mechanical flexibility, combined with high performance electronics, and integrated on a soft substrate offer unprecedented functionality for biomedical applications. This paper presents a brief snapshot on the materials of choice for niche flexible bio-implanted devices that address the requirements for both biodegradable and long-term operational streams. The paper also discusses potential future research directions in this rapidly growing field.
Integrated photonic platform for quantum information with continuous variables
Publisher: American Association for the Advancement of Science (AAAS)
Date: 07-12-2018
Abstract: An integrated optical chip is used for generating, manipulating, and detecting squeezed vacuum and two-mode entanglement.
The Piezoresistive Effect in Top–Down Fabricated p-Type 3C-SiC Nanowires
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2016
Flexible Nanoarchitectonics for Biosensing and Physiological Monitoring Applications
Publisher: Wiley
Date: 20-12-2022
Abstract: Flexible and implantable electronics hold tremendous promises for advanced healthcare applications, especially for physiological neural recording and modulations. Key requirements in neural interfaces include miniature dimensions for spatial physiological mapping and low impedance for recognizing small biopotential signals. Herein, a bottom‐up mesoporous formation technique and a top‐down microlithography process are integrated to create flexible and low‐impedance mesoporous gold (Au) electrodes for biosensing and bioimplant applications. The mesoporous architectures developed on a thin and soft polymeric substrate provide excellent mechanical flexibility and stable electrical characteristics capable of sustaining multiple bending cycles. The large surface areas formed within the mesoporous network allow for high current density transfer in standard electrolytes, highly suitable for biological sensing applications as demonstrated in glucose sensors with an excellent detection limit of 1.95 µ m and high sensitivity of 6.1 mA cm −2 µM −1 , which is approximately six times higher than that of benchmarking flat/non‐porous films. The low impedance of less than 1 kΩ at 1 kHz in the as‐synthesized mesoporous electrodes, along with their mechanical flexibility and durability, offer peripheral nerve recording functionalities that are successfully demonstrated in vivo. These features highlight the new possibilities of our novel flexible nanoarchitectonics for neuronal recording and modulation applications.
Onset of hippocampal network aberration and memory deficits in P301S tau mice are associated with an early gene signature
Publisher: Oxford University Press (OUP)
Date: 06-05-2020
Abstract: Hyperphosphorylation and deposition of tau in the brain characterizes frontotemporal dementia and Alzheimer’s disease. Disease-associated mutations in the tau-encoding MAPT gene have enabled the generation of transgenic mouse models that recapitulate aspects of human neurodegenerative diseases, including tau hyperphosphorylation and neurofibrillary tangle formation. Here, we characterized the effects of transgenic P301S mutant human tau expression on neuronal network function in the murine hippoc us. Onset of progressive spatial learning deficits in P301S tau transgenic TAU58/2 mice were paralleled by long-term potentiation deficits and neuronal network aberrations during electrophysiological and EEG recordings. Gene-expression profiling just prior to onset of apparent deficits in TAU58/2 mice revealed a signature of immediate early genes that is consistent with neuronal network hypersynchronicity. We found that the increased immediate early gene activity was confined to neurons harbouring tau pathology, providing a cellular link between aberrant tau and network dysfunction. Taken together, our data suggest that tau pathology drives neuronal network dysfunction through hyperexcitation of in idual, pathology-harbouring neurons, thereby contributing to memory deficits.
ScAlN/3C-SiC/Si platform for monolithic integration of highly sensitive piezoelectric and piezoresistive devices
Publisher: AIP Publishing
Date: 30-03-2020
DOI: 10.1063/5.0004943
Abstract: This paper reports on a platform for monolithic integration of piezoelectric and piezoresistive devices on a single chip using the ScAlN/3C-SiC/Si heterostructure. Surface acoustic wave devices with an electromechanical coupling of 3.2% and an out-of-band rejection as high as 18 dB are demonstrated using the excellent piezoelectric properties of ScAlN and low acoustic loss of 3C-SiC. Additionally, a large piezoresistive effect in the low-doped n-type 3C-SiC(100) thin film has been observed, which exceeds the previously reported values in any SiC thin films. The growth of the n-type 3C-SiC thin film was performed using the low pressure chemical vapor deposition technique at 1250 °C and the standard micro-electro-mechanical systems process is used for the fabrication of 3C-SiC piezoresistors. The piezoresistive effect was measured using the bending beam method in different crystallographic orientations. The maximum gauge factor is –47 for the longitudinal [100] orientation. Using the longitudinal and transverse gauge factors for different crystallographic orientations, the fundamental piezoresistive coefficients of the low-doped n-type 3C-SiC thin film are measured to be π11=(−14.5±1.3)×10−11 Pa−1, π12=(5.5±0.5)×10−11 Pa−1, and π44=(−1.7±0.7)×10−11 Pa−1.
Optoelectronic Enhancement for Piezoresistive Pressure Sensor
Publisher: IEEE
Date: 2020
Electrical Resistance of Carbon Nanotube Yarns under Compressive Transverse Pressure
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2018
A Smart, Textile-Driven, Soft Exosuit for Spinal Assistance
Publisher: MDPI AG
Date: 09-10-2023
DOI: 10.3390/S23198329
Giant piezoresistive effect by optoelectronic coupling in a heterojunction
Publisher: Springer Science and Business Media LLC
Date: 12-09-2019
DOI: 10.1038/S41467-019-11965-5
Abstract: Enhancing the piezoresistive effect is crucial for improving the sensitivity of mechanical sensors. Herein, we report that the piezoresistive effect in a semiconductor heterojunction can be enormously enhanced via optoelectronic coupling. A lateral photovoltage, which is generated in the top material layer of a heterojunction under non-uniform illumination, can be coupled with an optimally tuned electric current to modulate the magnitude of the piezoresistive effect. We demonstrate a tuneable giant piezoresistive effect in a cubic silicon carbide/silicon heterojunction, resulting in an extraordinarily high gauge factor of approximately 58,000, which is the highest gauge factor reported for semiconductor-based mechanical sensors to date. This gauge factor is approximately 30,000 times greater than that of commercial metal strain gauges and more than 2,000 times greater than that of cubic silicon carbide. The phenomenon discovered can pave the way for the development of ultra-sensitive sensor technology.
Self-Powered Broadband (UV-NIR) Photodetector Based on 3C-SiC/Si Heterojunction
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2019
Wet oxidation of 3C-SiC on Si for MEMS processing and use in harsh environments: Effects of the film thicknesses, crystalline orientations, and growth temperatures
Publisher: Elsevier BV
Date: 2021
Degraded boiling heat transfer from hotwire in ferrofluid due to particle deposition
Publisher: Elsevier BV
Date: 09-2018
Related Organisations
Fraunhofer-Institut Fur Zuverlässigkeit Und Mikrointegration
Location: Germany
Related Funding Activities
Discovery Projects - Grant ID: DP230101312
Start Date: 04-2024
End Date: 03-2027
Amount: $430,000.00
Funder: Australian Research Council
View Funded ActivityDiscovery Early Career Researcher Award - Grant ID: DE200100238
Start Date: 2020
End Date: 01-2024
Amount: $426,087.00
Funder: Australian Research Council
View Funded ActivityLinkage Projects - Grant ID: LP200100016
Start Date: 03-2021
End Date: 03-2024
Amount: $250,000.00
Funder: Australian Research Council
View Funded ActivityIndustrial Transformation Research Hubs - Grant ID: IH210100040
Start Date: 08-2022
End Date: 07-2027
Amount: $5,000,000.00
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View Funded Activity