ORCID Profile
0000-0002-5215-7443
Current Organisation
Xidian University
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In Research Link Australia (RLA), "Research Topics" refer to ANZSRC FOR and SEO codes. These topics are either sourced from ANZSRC FOR and SEO codes listed in researchers' related grants or generated by a large language model (LLM) based on their publications.
Information Systems | Global Information Systems | Computer System Security |
Application Software Packages (excl. Computer Games) | Application Tools and System Utilities
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2016
Publisher: IEEE
Date: 10-05-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2018
Publisher: IEEE
Date: 12-2021
DOI: 10.1109/ITHINGS-GREENCOM-CPSCOM-SMARTDATA-CYBERMATICS53846.2021.00041
Publisher: IEEE
Date: 11-2020
Publisher: IEEE
Date: 12-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Elsevier BV
Date: 04-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-03-2022
Publisher: IEEE
Date: 09-2021
Publisher: IEEE
Date: 20-10-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2022
Publisher: IEEE
Date: 05-2017
Publisher: IEEE
Date: 12-2018
Publisher: IEEE
Date: 08-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2022
Publisher: No publisher found
Date: 2019
Publisher: IEEE
Date: 10-2018
Publisher: IEEE
Date: 12-2016
Publisher: IEEE
Date: 12-2013
Publisher: Project MUSE
Date: 2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2023
Publisher: IEEE
Date: 04-2013
Publisher: IEEE
Date: 06-2015
Publisher: Springer International Publishing
Date: 2022
Publisher: Springer Science and Business Media LLC
Date: 07-01-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2010
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2017
Publisher: Institution of Engineering and Technology (IET)
Date: 02-2017
Publisher: Springer New York
Date: 2014
Publisher: Wiley
Date: 29-04-2016
DOI: 10.1002/CPE.3485
Publisher: Springer New York
Date: 2014
Publisher: Springer New York
Date: 2014
Publisher: Springer International Publishing
Date: 2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-04-2022
Publisher: Springer International Publishing
Date: 2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-04-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2021
Publisher: Springer International Publishing
Date: 2015
Publisher: Springer International Publishing
Date: 2015
Publisher: Springer International Publishing
Date: 2015
Publisher: Springer International Publishing
Date: 2015
Publisher: Springer International Publishing
Date: 2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-02-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2017
Publisher: ACM Press
Date: 2006
Publisher: IEEE
Date: 12-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2011
Publisher: ACM
Date: 07-11-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2020
Publisher: Elsevier BV
Date: 10-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-12-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2014
Publisher: IEEE
Date: 06-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-08-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2018
Publisher: Springer Singapore
Date: 2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2023
Publisher: IEEE
Date: 12-2019
Publisher: IEEE
Date: 12-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2023
Publisher: IEEE
Date: 06-2010
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2023
Publisher: IEEE
Date: 11-2015
Publisher: IEEE
Date: 11-2015
Publisher: IEEE
Date: 04-2010
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2022
Publisher: IEEE
Date: 09-2021
Publisher: IEEE
Date: 09-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Springer International Publishing
Date: 13-11-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2022
Publisher: Springer International Publishing
Date: 13-11-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2020
Publisher: Springer Science and Business Media LLC
Date: 27-11-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2020
Publisher: IEEE
Date: 12-2010
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2023
Publisher: IEEE
Date: 09-2018
Publisher: IEEE
Date: 12-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-05-2021
Publisher: Springer Nature Switzerland
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2020
Publisher: Springer Singapore
Date: 2021
Publisher: Springer Science and Business Media LLC
Date: 28-05-2010
Publisher: Springer Singapore
Date: 2021
Publisher: Springer Singapore
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2018
Publisher: Springer Singapore
Date: 2021
Publisher: Springer Singapore
Date: 2021
Publisher: Springer Singapore
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2014
Publisher: Springer Singapore
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2021
Publisher: IEEE
Date: 10-05-2021
Publisher: IEEE
Date: 2008
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-12-2017
Publisher: IEEE
Date: 11-2019
Publisher: Springer International Publishing
Date: 14-10-2016
Publisher: Elsevier BV
Date: 07-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2016
Publisher: Springer Science and Business Media LLC
Date: 09-07-2020
Publisher: ACM
Date: 28-11-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Springer Science and Business Media LLC
Date: 04-01-2018
Publisher: Springer Science and Business Media LLC
Date: 07-11-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2020
Publisher: Elsevier BV
Date: 10-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: IEEE
Date: 07-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2016
Publisher: SAGE Publications
Date: 2015
DOI: 10.1155/2015/692345
Abstract: Location information acquisition is crucial for many wireless sensor network (WSN) applications. While existing localization approaches mainly focus on 2D plane, the emerging 3D localization brings WSNs closer to reality with much enhanced accuracy. Two types of 3D localization algorithms are mainly used in localization application: the range-based localization and the range-free localization. The range-based localization algorithm has strict requirements on hardware and therefore is costly to implement in practice. The range-free localization algorithm reduces the hardware cost but at the expense of low localization accuracy. On addressing the shortage of both algorithms, in this paper, we develop a novel hybrid localization scheme, which utilizes the range-based attribute RSSI and the range-free attribute hopsize, to achieve accurate yet low-cost 3D localization. As anchor node deployment strategy plays an important role in improving the localization accuracy, an anchor node configuration scheme is also developed in this work by utilizing the MIS (maximal independent set) of a network. With proper anchor node configuration and propagation model selection, using simulations, we show that our proposed algorithm improves the localization accuracy by 38.9% compared with 3D DV-HOP and 52.7% compared with 3D centroid.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-10-2022
DOI: 10.36227/TECHRXIV.19255058
Abstract: Metaverse, as an evolving paradigm of the next-generation Internet, aims to build a fully immersive, hyper spatiotemporal, and self-sustaining virtual shared space for humans to play, work, and socialize. Driven by recent advances in emerging technologies such as extended reality, artificial intelligence, and blockchain, metaverse is stepping from science fiction to an upcoming reality. However, severe privacy invasions and security breaches (inherited from underlying technologies or emerged in the new digital ecology) of metaverse can impede its wide deployment. At the same time, a series of fundamental challenges (e.g., scalability and interoperability) can arise in metaverse security provisioning owing to the intrinsic characteristics of metaverse, such as immersive realism, hyper spatiotemporality, sustainability, and heterogeneity. In this paper, we present a comprehensive survey of the fundamentals, security, and privacy of metaverse. Specifically, we first investigate a novel distributed metaverse architecture and its key characteristics with ternary-world interactions. Then, we discuss the security and privacy threats, present the critical challenges of metaverse systems, and review the state-of-the-art countermeasures. Finally, we draw open research directions for building future metaverse systems.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-03-2022
Publisher: Elsevier BV
Date: 03-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-03-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2012
DOI: 10.1109/TMC.2011.36
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2020
Publisher: IEEE
Date: 05-2017
Publisher: IEEE
Date: 12-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2019
Publisher: IEEE
Date: 06-2011
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2014
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2022
Publisher: Springer International Publishing
Date: 19-12-2018
Publisher: ACM
Date: 28-11-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2020
Publisher: IEEE
Date: 09-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2023
Publisher: IEEE
Date: 09-2021
Publisher: IEEE
Date: 03-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2014
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2015
Publisher: Wiley
Date: 23-07-2012
DOI: 10.1002/WCM.2262
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2017
Publisher: IEEE
Date: 09-2021
Publisher: IEEE
Date: 10-2019
Publisher: IEEE
Date: 03-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: IEEE
Date: 12-2011
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2023
Publisher: IEEE
Date: 06-2011
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2018
Publisher: IEEE
Date: 04-2014
Publisher: SAGE Publications
Date: 12-2015
DOI: 10.1155/2015/769083
Publisher: IEEE
Date: 09-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2020
Start Date: 08-2020
End Date: 12-2023
Amount: $347,536.00
Funder: Australian Research Council
View Funded Activity