ORCID Profile
0000-0002-3114-781X
Current Organisations
Nanyang Technological University
,
Universitat Politècnica de Catalunya
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In Research Link Australia (RLA), "Research Topics" refer to ANZSRC FOR and SEO codes. These topics are either sourced from ANZSRC FOR and SEO codes listed in researchers' related grants or generated by a large language model (LLM) based on their publications.
Power and Energy Systems Engineering (excl. Renewable Power) | Electrical and Electronic Engineering | Renewable Power and Energy Systems Engineering (excl. Solar Cells) | Industrial Electronics | Aircraft Performance and Flight Control Systems | Control Systems, Robotics and Automation |
Energy Transmission and Distribution (excl. Hydrogen) | Energy Services and Utilities | Energy Storage (excl. Hydrogen) | Renewable Energy not elsewhere classified | Energy Conservation and Efficiency in Transport | Expanding Knowledge in Engineering | Air Passenger Transport
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2018
Publisher: IEEE
Date: 11-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2016
Publisher: IEEE
Date: 11-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2022
Publisher: IEEE
Date: 05-2013
Publisher: IEEE
Date: 10-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2023
Publisher: IEEE
Date: 03-2014
Publisher: IEEE
Date: 09-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2020
Publisher: IEEE
Date: 09-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2022
Publisher: Institution of Engineering and Technology (IET)
Date: 18-01-2017
Publisher: Institution of Engineering and Technology (IET)
Date: 2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2021
Publisher: IEEE
Date: 11-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2015
Publisher: IEEE
Date: 10-2016
Publisher: IEEE
Date: 12-2016
Publisher: IEEE
Date: 06-2015
Publisher: Institution of Engineering and Technology (IET)
Date: 12-03-2018
Publisher: IEEE
Date: 07-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: IEEE
Date: 05-2014
Publisher: IEEE
Date: 03-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2022
Publisher: IEEE
Date: 09-2014
Publisher: IEEE
Date: 11-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2014
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2018
Publisher: IEEE
Date: 10-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2016
Publisher: IEEE
Date: 03-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2023
Publisher: IEEE
Date: 12-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2021
Publisher: Institution of Engineering and Technology (IET)
Date: 10-2016
Publisher: IEEE
Date: 11-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2015
Publisher: MDPI AG
Date: 09-03-2022
DOI: 10.3390/EN15061985
Abstract: The circuit topology of a submodule (SM) in an modular multilevel converter (MMC) defines many of the functionalities of the complete power electronics conversion system and the specific applications that a specific MMC configuration can support. Most prominent among all applications for the MMC is its use in high-voltage direct current (HVDC) transmission systems and multiterminal dc grids. The aim of the paper is to provide a comprehensive review and classification of the many different SM circuit topologies that have been proposed for the MMC up to date. Using an 800-MVA, point-to-point MMC-based HVDC transmission system as a benchmark, the presented analysis identifies the limitations and drawbacks of certain SM configurations that limit their broader adoption as MMC SMs. A hybrid model of an MMC arm and appropriate implementations of voltage-balancing algorithms are used for detailed loss comparison of all SMs and to quantify differences among multiple SMs. The review also provides a comprehensive benchmark among all SM configurations, broad recommendations for the benefits and limitations of different SM topologies which can be further expanded based on the requirements of a specific application, and identifies future opportunities.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2013
Publisher: IEEE
Date: 05-2014
Publisher: Elsevier BV
Date: 02-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2024
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2022
Publisher: IEEE
Date: 12-2018
Publisher: IEEE
Date: 12-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2014
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2019
Publisher: IEEE
Date: 03-2015
Publisher: IEEE
Date: 06-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2020
Publisher: IEEE
Date: 06-2013
Publisher: IEEE
Date: 06-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2015
Publisher: Elsevier BV
Date: 06-2023
Publisher: IEEE
Date: 06-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2021
Publisher: MDPI AG
Date: 30-11-2016
DOI: 10.3390/EN9121012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2016
Publisher: IEEE
Date: 09-2013
Publisher: IEEE
Date: 10-2016
Publisher: IEEE
Date: 09-2016
Publisher: IEEE
Date: 05-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2022
Publisher: IEEE
Date: 10-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2023
Publisher: Springer Science and Business Media LLC
Date: 07-03-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2018
Publisher: IEEE
Date: 10-2016
Publisher: IEEE
Date: 12-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2022
Publisher: IEEE
Date: 10-2012
Publisher: IEEE
Date: 10-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2020
Publisher: IEEE
Date: 11-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2020
Publisher: IEEE
Date: 10-2018
Publisher: IEEE
Date: 10-2017
Publisher: IEEE
Date: 10-2016
Publisher: IEEE
Date: 03-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2014
Publisher: IEEE
Date: 10-2017
Publisher: Institution of Engineering and Technology
Date: 11-05-2016
Publisher: Elsevier BV
Date: 05-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2018
Publisher: IEEE
Date: 11-2013
Publisher: IEEE
Date: 11-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2018
Publisher: IEEE
Date: 12-2016
Publisher: Elsevier BV
Date: 11-2017
Publisher: Institution of Engineering and Technology (IET)
Date: 25-01-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2020
Publisher: IEEE
Date: 10-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2014
Publisher: IEEE
Date: 10-2017
Publisher: IEEE
Date: 10-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2022
Publisher: Springer Science and Business Media LLC
Date: 15-09-2021
DOI: 10.1038/S41576-021-00407-Y
Abstract: Plant intra-in idual and inter-in idual variation can be determined by the epigenome, a set of covalent modifications of DNA and chromatin that can alter genome structure and activity without changes to the genome sequence. The epigenome of plant cells is plastic, that is, it can change in response to internal or external cues, such as during development or due to environmental changes, to create a memory of such events. Ongoing advances in technologies to read and write epigenomic patterns with increasing resolution, scale and precision are enabling the extent of plant epigenome variation to be more extensively characterized and functionally interrogated. In this Review, we discuss epigenome dynamics and variation within plants during development and in response to environmental changes, including stress, as well as between plants. We review known or potential functions of such plasticity and emphasize the importance of investigating the causality of epigenomic changes. Finally, we discuss emerging technologies that may underpin future research into plant epigenome plasticity.
Start Date: 09-2016
End Date: 11-2016
Amount: $328,995.00
Funder: Australian Research Council
View Funded ActivityStart Date: 07-2016
End Date: 11-2016
Amount: $280,000.00
Funder: Australian Research Council
View Funded ActivityStart Date: 03-2021
End Date: 06-2024
Amount: $424,009.00
Funder: Australian Research Council
View Funded ActivityStart Date: 06-2020
End Date: 05-2024
Amount: $480,469.00
Funder: Australian Research Council
View Funded ActivityStart Date: 08-2019
End Date: 12-2023
Amount: $255,000.00
Funder: Australian Research Council
View Funded Activity