ORCID Profile
0000-0001-9365-3788
Current Organisation
Chongqing University
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Publisher: Hindawi Limited
Date: 31-10-2019
DOI: 10.1155/2019/7612805
Abstract: Sintering is an important approach for the alloying of different metals, which is affected by factors such as temperature, grain size, and material properties. And it represents a complex thermodynamic process. This paper had adopted the molecular dynamics methods to investigate the evolution process of nanostructure during the sintering of Cu and Au nanoparticles. The changes in crystalline during the nanosintering process were observed, and the radial distribution function of atoms, the shrinkage ratio, and the sintering neck of the systems were discussed. The initial sintering temperature and melting temperature of the system were obtained at the same time, the characteristics of the sintering neck with changes in temperature during the nanosintering process were revealed.
Publisher: MDPI AG
Date: 08-07-2018
DOI: 10.3390/MA11071164
Publisher: Elsevier BV
Date: 12-2017
Publisher: World Scientific Pub Co Pte Lt
Date: 06-02-2017
DOI: 10.1142/S0217979217500163
Abstract: Due to its geometry simplicity, the forces of thin liquid film are widely investigated and equivalently employed to explore the phys–chemical properties and mechanical stability of many other surfaces or colloid ensembles. The surface tension of bulk liquid ([Formula: see text]) and film tension ([Formula: see text]) are the most important parameters. Considering the insufficiency of detailed interpretation of film tension under micro-scale circumstances, a method for film tension was proposed based on numerical modeling. Assuming surface tension at different slab thicknesses being identical to the surface tension of film, the surface tension and disjoining pressure were subsequently used to evaluate the film tension based on the derivation of film thermodynamics, and a decreasing tendency was discovered for low temperature regions. The influence of saline concentration on nano-films was also investigated, and the comparison of film tensions suggested that higher concentration yielded larger film tension, with stronger decreasing intensity as a function of film thickness. Meanwhile, at thick film range (15–20 nm), film tension of higher concentration film continued to decrease as thickness increase, however it arrived to constant value for that of lower concentration. Finally, it was found that the film tension was almost independent on the film curvature, but varied with the thickness. The approach is applicable to symmetric emulsion films containing surfactants and bi-layer lipid films.
Publisher: Elsevier BV
Date: 03-2020
Publisher: Elsevier BV
Date: 07-2019
Publisher: World Scientific Pub Co Pte Lt
Date: 20-04-2016
DOI: 10.1142/S0217984916501694
Abstract: Development of disjoining pressure was performed to study the symmetric, Lennard-Jones (LJ) free thin films using molecular modelling. A methodology rooted from film thermodynamics was established to derive the disjoining pressure isotherm [Formula: see text], which is based on the surface tension at varied film thicknesses and can be viewed as a post-processing technique. The results showed that the disjoining pressure of LJ fluid is purely attractive. Compared with the complicated method reported previously, this methodology is demonstrated to be more convenient and readily applicable for other liquid films (e.g. water, aqueous thin films containing electrolyte or surfactants), meanwhile it can be applied at both low and high temperatures.
Publisher: Hindawi Limited
Date: 31-03-2020
DOI: 10.1155/2020/1018369
Publisher: Elsevier BV
Date: 09-2020
Publisher: Elsevier BV
Date: 07-2021
Publisher: Elsevier BV
Date: 2020
Publisher: Elsevier BV
Date: 2021
Publisher: Hindawi Limited
Date: 15-05-2019
DOI: 10.1002/ER.4599
Publisher: Elsevier BV
Date: 11-2016
Publisher: Royal Society of Chemistry (RSC)
Date: 2015
DOI: 10.1039/C5CP03050A
Abstract: The disjoining pressures of thin aqueous salt films at different salt concentrations and temperatures were calculated using MD simulations.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2020
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