ORCID Profile
0000-0002-3791-6368
Current Organisation
Universiti Sains Malaysia
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Publisher: Springer Science and Business Media LLC
Date: 29-01-2018
Publisher: Emerald
Date: 04-2019
DOI: 10.1108/SSMT-08-2018-0024
Abstract: This study aims to investigate the NiO nano-reinforced solder joint characteristics of ultra-fine electronic package. Lead-free Sn-Ag-Cu (SAC) solder paste was mixed with various percentages of NiO nanoparticles to prepare the new form of nano-reinforced solder paste. The solder paste was applied to assemble the ultra-fine capacitor using the reflow soldering process. A focussed ion beam, high resolution transmission electron microscopy system equipped with energy dispersive X-ray spectroscopy (EDS) was used in this study. In addition, X-ray inspection system, field emission scanning electron microscopy coupled with EDS, X-ray photoelectron spectroscopy (XPS) and nanoindenter were used to analyse the solder void, microstructure, hardness and fillet height of the solder joint. The experimental results revealed that the highest fillet height was obtained with the content of 0.01 Wt.% of nano-reinforced NiO, which fulfilled the reliability requirements of the international IPC standard. However, the presence of the NiO in the lead-free solder paste only slightly influenced the changes of the intermetallic layer with the increment of weighted percentage. Moreover, the simulation method was applied to observe the distribution of NiO nanoparticles in the solder joint. The findings are expected to provide a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package.
Publisher: Trans Tech Publications, Ltd.
Date: 12-2014
DOI: 10.4028/WWW.SCIENTIFIC.NET/AMM.465-466.1319
Abstract: This study is intended to predict the stress behavior of thick hard coating at the interface with the changes of coating stiffness and thickness to the substrate of Ti-6Al-4V and SCMV. The elastic mismatch between the coating and the substrate is presented in the value of Dundurs parameter α . The prediction is done using simple geometry of a cylinder-on-flat model in 2D analysis subjected to normal and tangential loading. Tangential stress distribution along the coating-substrate interface is then obtained from the FE modelling after a finite sliding of the cylinder. It is predicted that the maximum tangential stress value predicted at the interface which relates to coating fracture failure is increasing as stiffer coating is used on compliant substrate (i.e. increasing α values). The location of the maximum tangential stress predicted also changes from the trailing edge to the center of contact with increasing α values. Effect of changes of coating thickness on the predicted maximum tangential stress value is more significant for high positive α values. Risk of coating fracture at the interface is therefore predicted to increase with the increase of coating thickness and stiffness.
Publisher: Emerald
Date: 05-02-2018
DOI: 10.1108/SSMT-04-2017-0011
Abstract: This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO 2 nanoparticles in an electronic assembly. This study focused on the microstructure and quality of solder joints. Various percentages of TiO 2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO 2 content of 0.05 Wt.%. Increasing the TiO 2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO 2 on the microstructure and the fillet height of ultra-fine capacitors.
Publisher: IEEE
Date: 10-2012
Location: United Kingdom of Great Britain and Northern Ireland
No related grants have been discovered for Abdullah Aziz Saad.