ORCID Profile
0000-0002-3690-0321
Current Organisation
CSIRO (Data61)
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Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2017
Publisher: IEEE
Date: 12-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2022
Publisher: Wiley
Date: 20-06-2022
Abstract: Reversing the conventional site‐selectivity of C−H activation processes provides new retrosynthetic disconnections to otherwise unreactive bonds. Here, we report a new catalytic system based on palladium/norbornene and an S,O‐ligand for the meta ‐C−H arylation of aryl ethers that significantly outperforms previously reported systems. We demonstrate the unique ability of this system to employ alkoxyarene substrates bearing electron donating and withdrawing substituents. Additionally, ortho ‐substituted aryl ethers are well tolerated, overcoming the “ ortho constraint”, which is the necessity to have a meta ‐substituent on the alkoxyarene to achieve high reaction efficiency, by enlisting novel norbornene mediators. Remarkably, for the first time the monoarylation of alkoxyarenes is achieved efficiently enabling the subsequent introduction of a second, different aryl coupling partner to rapidly furnish unsymmetrical terphenyls. Further insight into the reaction mechanism was achieved by isolation and characterization of some Pd‐complexes—before and after meta C−H activation—prior to evaluation of their respective catalytic activities.
Publisher: Springer Science and Business Media LLC
Date: 05-06-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-07-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2022
Publisher: Cambridge University Press
Date: 31-05-2022
Abstract: Discover the fundamental characteristics of ultra-dense networks with this comprehensive text. Featuring a consistent mathematical description of ultra-dense small cell networks while also covering real-world issues such as network deployment, operation and optimization, this book investigates performance metrics of coverage probability and area spectral efficiency (ASE) and addresses the aspects of ultra-dense networks that make them different from current networks. Insightful intuitions, which will assist decision-makers as they migrate their services, are explained and mathematically proven. The book presents the latest review of research outcomes on ultra-dense networks, based on both theoretical analyses and network simulations, includes over 200 sources from 3GPP, the Small Cell Forum, journals and conference proceedings, and covers all other related and prominent topics. This is an ideal reference text for professionals who are dealing with the development, deployment, operation and maintenance of ultra-dense small cell networks, as well as researchers and graduate students in communications.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2019
Publisher: IEEE
Date: 04-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 11-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2019
Publisher: Elsevier BV
Date: 12-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Springer International Publishing
Date: 2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2020
Publisher: Elsevier BV
Date: 09-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2019
Publisher: IEEE
Date: 05-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 02-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2022
Publisher: Wiley
Date: 13-12-2023
DOI: 10.1002/CPE.7554
Abstract: Privacy leakage in images attracts increasing concerns these days, as photos uploaded to large social platforms are usually not processed by proper privacy protection mechanisms. Moreover, with advanced artificial intelligence (AI) tools such as deep neural network (DNN), an adversary can detect people's identities and collect other sensitive personal information from images at an unprecedented scale. In this paper, we introduce a novel face image de‐identification framework using adversarial perturbations in the feature space. Manipulating the feature space vector ensures the good transferability of our framework. Moreover, the proposed feature space adversarial perturbation generation algorithm can successfully protect the identity‐related information while ensuring the other attributes remain similar. Finally, we conduct extensive experiments on two face image datasets to evaluate the performance of the proposed method. Our results show that the proposed method can generate real‐looking privacy‐preserving images efficiently. Although our framework has only been tested on two real‐life face image datasets, it can be easily extended to other types of images.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2016
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 09-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-12-2021
Publisher: Association for Computing Machinery (ACM)
Date: 03-02-2023
DOI: 10.1145/3501296
Abstract: Recent advances in communication technologies and the Internet-of-Medical-Things (IOMT) have transformed smart healthcare enabled by artificial intelligence (AI). Traditionally, AI techniques require centralized data collection and processing that may be infeasible in realistic healthcare scenarios due to the high scalability of modern healthcare networks and growing data privacy concerns. Federated Learning (FL), as an emerging distributed collaborative AI paradigm, is particularly attractive for smart healthcare, by coordinating multiple clients (e.g., hospitals) to perform AI training without sharing raw data. Accordingly, we provide a comprehensive survey on the use of FL in smart healthcare. First, we present the recent advances in FL, the motivations, and the requirements of using FL in smart healthcare. The recent FL designs for smart healthcare are then discussed, ranging from resource-aware FL, secure and privacy-aware FL to incentive FL and personalized FL. Subsequently, we provide a state-of-the-art review on the emerging applications of FL in key healthcare domains, including health data management, remote health monitoring, medical imaging, and COVID-19 detection. Several recent FL-based smart healthcare projects are analyzed, and the key lessons learned from the survey are also highlighted. Finally, we discuss interesting research challenges and possible directions for future FL research in smart healthcare.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2018
Publisher: IEEE
Date: 05-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2018
Publisher: ACM
Date: 30-04-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2018
Publisher: Springer Nature Switzerland
Date: 2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-06-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2023
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2019
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 15-08-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2020
Location: China
No related grants have been discovered for Ming Ding.