ORCID Profile
0000-0002-3914-3741
Current Organisation
University of Sydney
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Publisher: IEEE
Date: 06-2013
Publisher: IEEE
Date: 06-2013
Publisher: IEEE
Date: 10-2014
Publisher: Wiley
Date: 02-1999
DOI: 10.1002/(SICI)1097-4563(199902)16:2<81::AID-ROB2>3.0.CO;2-9
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2013
Publisher: Elsevier BV
Date: 09-1996
Publisher: Springer Berlin Heidelberg
Date: 2006
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2014
Publisher: IEEE
Date: 07-2014
Publisher: IEEE
Date: 1998
Publisher: IEEE
Date: 10-2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2012
Publisher: IEEE
Date: 2006
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2013
Publisher: Universidad de Alicante Servicio de Publicaciones
Date: 2010
Publisher: Universidad de Alicante Servicio de Publicaciones
Date: 2010
Publisher: Elsevier BV
Date: 12-2001
Publisher: Springer International Publishing
Date: 2016
Publisher: Wiley
Date: 06-2010
DOI: 10.1002/ROB.20349
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2012
Publisher: IEEE
Date: 05-2009
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 12-2015
Publisher: IEEE
Date: 03-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2014
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2021
Publisher: IEEE
Date: 10-2012
Publisher: IEEE
Date: 06-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2018
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2001
DOI: 10.1109/70.938382
Publisher: Springer Science and Business Media LLC
Date: 1999
Publisher: IEEE
Date: 09-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2001
DOI: 10.1109/70.964672
Publisher: Elsevier BV
Date: 2007
Publisher: IEEE
Date: 10-2011
Publisher: IEEE
Date: 09-2010
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 03-2011
Publisher: Wiley
Date: 30-09-2003
DOI: 10.1002/ROB.10112
Publisher: IEEE
Date: 09-2010
Publisher: IEEE
Date: 05-2018
Publisher: IEEE
Date: 05-2014
Publisher: Springer Science and Business Media LLC
Date: 05-06-2010
Publisher: IEEE
Date: 09-2015
Publisher: IEEE
Date: 05-2010
Publisher: Elsevier BV
Date: 02-2015
Publisher: IEEE
Date: 06-2013
Publisher: Elsevier BV
Date: 02-1999
Publisher: IEEE
Date: 1998
Publisher: IEEE
Date: 12-2011
Publisher: IEEE
Date: 09-2010
Publisher: IEEE
Date: 06-2013
Publisher: IEEE
Date: 1998
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2016
Publisher: IEEE
Date: 04-2007
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 08-2003
Publisher: IEEE
Date: 06-2018
Publisher: IEEE
Date: 10-2018
Publisher: IEEE
Date: 10-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 10-2012
Publisher: Informa UK Limited
Date: 1999
Publisher: IEEE
Date: 1996
Publisher: IEEE
Date: 09-2008
Publisher: IEEE
Date: 1996
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 1991
DOI: 10.1109/78.80772
Publisher: IEEE
Date: 09-2008
Publisher: IEEE
Date: 06-2017
Publisher: IEEE
Date: 06-2011
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2014
Publisher: IOP Publishing
Date: 19-05-2011
Publisher: Springer Berlin Heidelberg
Date: 1997
Publisher: Elsevier BV
Date: 08-2008
Publisher: Springer Berlin Heidelberg
Date: 1996
DOI: 10.1007/BFB0013958
Publisher: Elsevier BV
Date: 1996
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2019
Publisher: IEEE
Date: 06-2013
Publisher: IEEE
Date: 05-2008
Publisher: IEEE
Date: 06-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 1999
DOI: 10.1109/70.744605
Publisher: Elsevier BV
Date: 03-2011
Publisher: Elsevier BV
Date: 10-1998
Publisher: IEEE
Date: 06-2018
Publisher: Elsevier BV
Date: 08-2018
Publisher: Wiley
Date: 2006
DOI: 10.1002/ROB.20114
Publisher: IEEE
Date: 10-2006
Publisher: IEEE
Date: 05-2011
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-1999
DOI: 10.1109/70.768189
Publisher: IEEE
Date: 10-2006
Publisher: SAGE Publications
Date: 04-2004
Abstract: In this paper we address the problem of autonomous navigation in very large unstructured environments. A new hybrid metric map (HYMM) structure is presented that combines feature maps with other metric representations in a consistent manner. The global feature map is partitioned into a set of connected local triangular regions (LTRs), which provide a reference for a detailed multidimensional description of the environment. The HYMM framework permits the combination of efficient feature-based simultaneous localization and mapping (SLAM) algorithms for localization with, for ex le, occupancy grid maps for tasks such as obstacle avoidance, path planning or data association. This fusion of feature and grid maps has several complementary properties for ex le, grid maps can assist data association and can facilitate the extraction and incorporation of new landmarks as they become identified from multiple vantage points. In this paper we also present a path-planning technique that efficiently maintains the estimated cost of traversing each LTR. The consistency of the SLAM algorithm is investigated with the introduction of exploration techniques to guarantee a certain measure of performance for the estimation process. Experimental results in outdoor environments are presented to demonstrate the performance of the algorithms proposed.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 1998
DOI: 10.1109/70.704234
Publisher: SAGE Publications
Date: 08-2006
Abstract: This paper addresses the problem of environment representation for Simultaneous Localization and Mapping (SLAM) algorithms. One of the main problems of SLAM is how to interpret and synthesize the external sensory information into a representation of the environment that can be used by the mobile robot to operate autonomously. Traditionally, SLAM algorithms have relied on sparse environment representations. However, for autonomous navigation, a more detailed representation of the environment is necessary, and the classic feature-based representation fails to provide a robot with sufficient information. While a dense representation is desirable, it has not been possible for SLAM paradigms. This paper presents DenseSLAM, an algorithm to obtain and maintain detailed environment representations. The algorithm represents different sensory information in dense multi-layered maps. Each layer can represent different properties of the environment, such as occupancy, traversability, elevation or each layer can describe the same environment property using different representations. Implementations of the algorithm with two different representations for the dense maps are shown. A rich representation has several potential advantages to assist the navigation process, for ex le to facilitate data association using multi-dimensional maps. This paper presents two particular applications to improve the localization process the extraction of complex landmarks from the dense maps and the detection of areas with dynamic objects. The paper also presents an analysis of consistency of the maps obtained with DenseSLAM. The position error in the dense maps is analyzed and a method to select the landmarks in order to minimize these errors is explained. The algorithm was tested with outdoor experimental data taken with a ground vehicle. The experimental results show that the algorithm can obtain dense environment representations and that the detailed representation can be used to improve the vehicle localization process.
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-2020
Publisher: IEEE
Date: 06-2014
Publisher: Informa UK Limited
Date: 22-11-2021
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 2020
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 07-2000
DOI: 10.1109/87.852913
Publisher: IEEE
Date: 10-2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 04-2014
Publisher: IEEE
Date: 10-2006
Publisher: Springer Berlin Heidelberg
Date: 2008
Publisher: Trans Tech Publications, Ltd.
Date: 11-2012
DOI: 10.4028/WWW.SCIENTIFIC.NET/AMR.410.110
Abstract: Among different sterilization methods, heat-treatment of bone is recognized as one of the simple and practical methods to lower the human immunodeficiency virus (HIV) infection and overcome the risks of rejection and disease transfer from allograft and xenograft during bone transplantation. In order to best characterize the micro-structural mechanical property of bone after heat treatment, the nanoindentation technique was applied in this study to measure the localized elastic modulus and hardness for interstitial lamellae and osteons lamellae of bovine cortical bones at temperature 23°C (room temperature-pristine specimen), 37°C, 90°C, 120°C and 160°C, respectively. The elastic modulus (E) and hardness (H) of interstitial lamellae obtained higher values as compared with osteons lamellae which show that interstitial lamellae are more stiff and mineralized than osteons. Moreover, as a specimen pre-heat treated at 90°C, the E and H values of interstitial lamellae and osteons were closed to a pristine specimen. For a specimen pre-heat treated at 120°C, both interstitial lamellae and osteons obtained an increase in E and H values. As a specimen pre-heat treated at 160°C, the interstitial lamellae and osteons obtained a slight decrease in E and H values. These findings are correlated to results reported by other researchers [1, 2] that calcified collagen molecules starts to degenerate at about 120°C and complete at 160°C. Interestingly, when a specimen was pre-heat treated at 37°C, both interstitial lamellae and osteons obtained significant decreases in E values of 57% and 40%, respectively as compared to the pristine specimen while in H values, there was a decrease of 27.4% and 15%, respectively. Thus, this paper will investigate the mechanical properties of bovine cortical bones under various temperature ranges by nanoindentation technique.
Publisher: Elsevier BV
Date: 08-2002
Publisher: Wiley
Date: 10-2000
DOI: 10.1002/1097-4563(200010)17:10<565::AID-ROB4>3.0.CO;2-6
Publisher: IEEE
Date: 09-2010
Publisher: IEEE
Date: 06-2013
Publisher: No publisher found
Date: 2012
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 05-1997
DOI: 10.1109/9.580885
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Date: 06-2014
No related grants have been discovered for Eduardo nebot.