Linkage - International - Grant ID: LX0776049

Funding Activity

Does something not look right? The information on this page has been harvested from data sources that may not be up to date. We continue to work with information providers to improve coverage and quality. To report an issue, use the .

Funded Activity Summary

Effect of Chemo-Mechanical Grinding on Surface Integrity of Single Crystal Silicon Substrates. Silicon substrates or wafers are extensively used in electronic and optic/photonic industries. A long-time standing problem in silicon wafer machining is the surface and subsurface damage induced by machining. This may significantly affect the mechanical, optical and electronic characteristics of wafer-based components. The issue becomes increasingly more critical as the application of silicon wafers is extending further as structural components. The research outcomes will contribute an improved understanding of Chemo Mechanical Grinding process and help to develop innovative technologies for silicon industries.

Funded Activity Details

Start Date: 01-01-2007

End Date: 31-03-2010

Funding Scheme: Linkage - International

Funding Amount: $50,000.00

Funder: Australian Research Council