Linkage - International - Grant ID: LX0240472

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/LX0240472

Funding Status
Closed

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Funded Activity Summary

Development of Solid-state cooling chips. The performance of modern electronic, microelectronic, optoelectronic and photonic devices improves as they are cooled. We aim to develop semiconductor cooling elements that can be directly integrated into existing circuits and devices. The new solid-state cooling elements will be reliable, robust, scalable and operate in any orientation. The proposed international collaboration combines the expertise of the Chinese Academy of Science in device fabrication with the expertise of the University of Wollongong in device characterisation and modelling. The outcome of this research has the potential to revolutionize cooling of diverse electronic systems, from computer motherboards to mobile phones.

Funded Activity Details

Start Date: 08-04-2002

End Date: 31-12-2004

Funding Scheme: Linkage - International

Funding Amount: $21,200.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Interdisciplinary Engineering | Nanotechnology | Other Electronic Engineering | Heat And Mass Transfer Operations

ANZSRC Socio-Economic Objective (SEO)

Conservation and efficiency | Integrated systems |

Other Keywords

Conservation and efficiency | Heat And Mass Transfer Operations | Integrated systems | Interdisciplinary Engineering | Nanotechnology | Other Electronic Engineering

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