Linkage Projects - Grant ID: LP210301248

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/LP210301248

Funding Status
Active

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Funded Activity Summary

Systematic investigations of low temperature Sn-Bi based solder alloys . The project aims to reduce the temperatures used in the manufacture of electronic circuitry through the development of Sn-Bi alloys for low temperature assembly processes without compromising productivity or reliability. The project will use a range of innovative solidification and microstructure development techniques to obtain an understanding of the dynamic processes of precipitation, dissolution and microstructure evolution that occur in these alloys during manufacture and application. The outcomes include a reduction in the energy consumed in electronic assembly processes and a capacity to manufacture advanced circuitry based on next-generation temperature-sensitive components and substrates without compromising reliability.

Funded Activity Details

Start Date: 01-01-2023

End Date: 31-12-2025

Funding Scheme: Linkage Projects

Funding Amount: $455,649.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Materials Engineering | Metals and Alloy Materials

ANZSRC Socio-Economic Objective (SEO)

Fabricated Metal Products not elsewhere classified |

Other Keywords

Fabricated Metal Products not elsewhere classified | Materials Engineering | Metals and Alloy Materials

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