Linkage Projects - Grant ID: LP180100595

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/LP180100595

Funding Status
Active

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Funded Activity Summary

Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.

Funded Activity Details

Start Date: 14-10-2019

End Date: 30-06-2023

Funding Scheme: Linkage Projects

Funding Amount: $351,705.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Manufacturing Processes and Technologies (excl. Textiles) | Microelectronics and Integrated Circuits | Materials Engineering | Metals and Alloy Materials

ANZSRC Socio-Economic Objective (SEO)

Integrated Circuits and Devices | Metals (e.g. Composites, Coatings, Bonding) |

Other Keywords

Integrated Circuits and Devices | Manufacturing Processes and Technologies (excl. Textiles) | Materials Engineering | Metals (e.g. Composites, Coatings, Bonding) | Metals and Alloy Materials | Microelectronics and Integrated Circuits

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