Linkage Projects - Grant ID: LP140100344

Funded Activity Summary

High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.

Funded Activity Details

Start Date: 15-05-2015

End Date: 31-12-2020

Funding Scheme: Linkage Projects

Funding Amount: $450,000.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Electrical and Electronic Engineering | Elemental Semiconductors | Microelectronics and Integrated Circuits | Microwave and Millimetrewave Theory and Technology

ANZSRC Socio-Economic Objective (SEO)

Diagnostic Methods | National Security | Communication Networks and Services not elsewhere classified |

Other Keywords

Communication Networks and Services not elsewhere classified | Diagnostic Methods | Electrical and Electronic Engineering | Elemental Semiconductors | Microelectronics and Integrated Circuits | Microwave and Millimetrewave Theory and Technology | National Security

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