Linkage Projects - Grant ID: LP130100108

Funding Activity

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Funded Activity Summary

Heat conduction characterisation of buried insulation layers in silicon-on-insulator systems. This project aims to establish a new technique for the accurate characterisation of thermal conduction in buried insulation layers in advanced silicon-on-insulator (SOI) systems. The success of the project will enable the Australian semiconductor industry to develop high performance SOI systems.

Funded Activity Details

Start Date: 01-05-2014

End Date: 31-12-2018

Funding Scheme: Linkage Projects

Funding Amount: $310,949.00

Funder: Australian Research Council