Linkage Projects - Grant ID: LP120200509

Funding Activity

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Funded Activity Summary

Exploiting deep sub-surface temperature-induced phase-transformations for an improved approach to semiconductor laser-dicing. This project aims to explore sub-surface laser-induced phase transformations in semiconductors and to exploit this novel method for ultra-fine laser cutting of semiconductor wafers without debris. The outcomes will be understanding new temperature-induced material modifications and innovative technology development relevant for the semiconductor industry.

Funded Activity Details

Start Date: 01-06-2013

End Date: 31-12-2014

Funding Scheme: Linkage Projects

Funding Amount: $180,000.00

Funder: Australian Research Council