Linkage Projects - Grant ID: LP0882791

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/LP0882791

Funding Status
Closed

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Funded Activity Summary

Non-destructive characterisation of residual stresses for the silicon-on-sapphire technology. Every sapphire wafer for the fabrication of integrated circuits using the silicon-on-sapphire technology is worth more than a thousand dollars, and the cost grows exponentially with successive processing of circuitry. Early detection and prevention of wafer failure is therefore an economic and quality necessity. The fast, non-destructive method to be developed by the proposed research will enable semiconductor electronics manufacturers to achieve a cost-effective fabrication of integrated circuits by detecting damages in wafers at the very early stage of production.

Funded Activity Details

Start Date: 01-05-2008

End Date: 01-05-2011

Funding Scheme: Linkage Projects

Funding Amount: $290,076.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Manufacturing Engineering Not Elsewhere Classified | Manufacturing Engineering | Ceramics

ANZSRC Socio-Economic Objective (SEO)

Manufactured products not elsewhere classified |

Other Keywords

Ceramics | Manufactured products not elsewhere classified | Manufacturing Engineering | Manufacturing Engineering Not Elsewhere Classified

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