Linkage Projects - Grant ID: LP0346966

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/LP0346966

Funding Status
Closed

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Funded Activity Summary

Surface Integrity Characterization of Sapphire Wafers for Wireless and Fibre Optic Semiconductor Industry. This project aims to uncover the mechanism of surface integrity in sapphire wafers and thus to establish its relationship with the quality processing of integrated circuits. The project will comprehensively consider surface damage, residual stresses, thermal shock and dislocation evolution as an organic whole to provide an effective solution to the problems in the current production practice. Problems caused by unsatisfactory surface integrity represent a major outlay for the wireless and fibre optic semiconductor industry. The proposed research holds the very real possibility of reducing the capital cost and enhancing the quality of the integrated circuits of high capacity.

Funded Activity Details

Start Date: 01-12-2003

End Date: 30-11-2007

Funding Scheme: Linkage Projects

Funding Amount: $260,000.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Industrial Engineering | Mechanical Engineering

ANZSRC Socio-Economic Objective (SEO)

Integrated circuits and devices |

Other Keywords

Industrial Engineering | Integrated circuits and devices | Mechanical Engineering

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