Linkage Infrastructure, Equipment and Facilities - Grant ID: LE0347464

Funded Activity Summary

Setting up an integrated wirebonding and testing facility for MEMS applications. This project intends to setup an integrated wire bonding and testing facility suitable for Micro electromechanical systems (MEMS) applications. Wire bonding is an essential step for making the contacts of any micro device with external power supply or signal conditioning circuitry. The contact pads for such devices vary in size from 0.050 mm x 0.050 mm to few 100s of micrometers. The proposed facility will be required for making contacts either using thermal or ultrasonic methods with complete automatic stages. The electrical contacts are used to drive or monitor MEMS, Polymer micro devices and nano- fluidic systems. This facility will be used for different applications including photonics and communication devices (RMIT), flexi circuits and microwave devices (DSTO) and micro/nano fluidic systems (SUT). This will be the only advanced integrated facility in Victoria, which will have the wire bonding(ball & wedge), die bonding and bond testing facilities together.

Funded Activity Details

Start Date: 01-07-2003

End Date: 30-06-2004

Funding Scheme: Linkage Infrastructure, Equipment and Facilities

Funding Amount: $100,000.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Electrical and Electronic Engineering | Nanotechnology | Other Electronic Engineering | Optical And Photonic Systems |

ANZSRC Socio-Economic Objective (SEO)

Integrated circuits and devices | Physical sciences | Instrumentation not elsewhere classified

Other Keywords

Electrical and Electronic Engineering | Instrumentation not elsewhere classified | Integrated circuits and devices | Nanotechnology | Optical And Photonic Systems | Other Electronic Engineering | Physical sciences

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