Linkage Infrastructure, Equipment and Facilities - Grant ID: LE0346666

Funding Activity

Does something not look right? The information on this page has been harvested from data sources that may not be up to date. We continue to work with information providers to improve coverage and quality. To report an issue, use the .

Funded Activity Summary

Mobile high power diode laser for thermal processing applications. This proposal seeks to establish a mobile, high-power diode laser facility for thermal processing of in-situ components in the power generation, defence, shipbuilding and mining industries. Diode lasers offer significant advantages for laser thermal processing over conventional CO2 and Nd:YAG lasers in terms of their output wavelength, size and efficiency. The mobile high power diode laser facility will help build a strong infrastructure for in-situ repair of worn components and is expected to reduce overall component repair costs and time.

Funded Activity Details

Start Date: 01-06-2003

End Date: 31-05-2004

Funding Scheme: Linkage Infrastructure, Equipment and Facilities

Funding Amount: $260,000.00

Funder: Australian Research Council