Mid-Career Industry Fellowships - Grant ID: IM230100396

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/IM230100396

Funding Status
Active

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Funded Activity Summary

Scalable semiconductor quantum processor with flip chip bonding technology. Australia is famous for quantum computing research based on electron spin in silicon quantum dot. This project aims to enable the manufacturing of such scalable quantum processor. Currently, superconducting quantum processor has reached >100 of qubits by the utilization of 3D integration fabrication technology such as flip chip bonding. Likewise, for semiconductor spin-qubit to grow, it is inevitable that novel 3D architecture by expanding the building block to the next dimension must be explored to pave the way to scalable semiconductor quantum processor. This project will spearhead Australia's semiconductor quantum processor to the realm of hundreds of qubits and put this technology on par with superconducting quantum processor.

Funded Activity Details

Start Date: 21-07-2023

End Date: 20-07-2026

Funding Scheme: Mid-Career Industry Fellowships

Funding Amount: $764,472.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Quantum information computation and communication | Quantum technologies | Quantum physics | Quantum engineering systems (incl. computing and communications) |

ANZSRC Socio-Economic Objective (SEO)

Other Keywords

Expanding Knowledge In Engineering | Expanding Knowledge In the Physical Sciences | Other Manufacturing Not Elsewhere Classified | Quantum engineering systems (incl. computing and communications) | Quantum information computation and communication | Quantum physics | Quantum technologies

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