ARC Future Fellowships - Grant ID: FT230100104

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/FT230100104

Funding Status
Active

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Funded Activity Summary

Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.

Funded Activity Details

Start Date: 30-06-2024

End Date: 29-06-2028

Funding Scheme: ARC Future Fellowships

Funding Amount: $871,410.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Microelectronics | Electronics sensors and digital hardware | Circuits and systems |

ANZSRC Socio-Economic Objective (SEO)

Other Keywords

Circuits and systems | Electronics sensors and digital hardware | Microelectronics | Mobile Technologies and Communications | Wireless Technologies, Networks and Services

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