Discovery Projects - Grant ID: DP200101949

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/DP200101949

Funding Status
Active

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Funded Activity Summary

Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.

Funded Activity Details

Start Date: 03-04-2020

End Date: 31-12-2023

Funding Scheme: Discovery Projects

Funding Amount: $430,000.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Microelectronics and Integrated Circuits | Materials Engineering | Metals and Alloy Materials

ANZSRC Socio-Economic Objective (SEO)

Integrated Circuits and Devices | Fabricated Metal Products not elsewhere classified |

Other Keywords

Fabricated Metal Products not elsewhere classified | Integrated Circuits and Devices | Materials Engineering | Metals and Alloy Materials | Microelectronics and Integrated Circuits

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