Discovery Projects - Grant ID: DP0773123

Funding Activity

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Funded Activity Summary

Damage-Free Surfacing of Large Brittle Wafers with On-Machine Flatness Control. The knowledge gained from this research project will be of great value to the development of new generations of high-integrity semiconductor systems for high-speed telecommunication, large-scale computation, transport, biomedicine, agriculture, mining and security. The outcomes will have significant impact on the ultra-precision discipline scientifically and will sharpen the competitive edge of the Australian fabrication industry. The research will open up remarkable opportunities for young researchers to work in one of the most frontier fields in the 21st century.

Funded Activity Details

Start Date: 01-02-2007

End Date: 31-01-2012

Funding Scheme: Discovery Projects

Funding Amount: $1,202,882.00

Funder: Australian Research Council