Discovery Projects - Grant ID: DP0344929

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/DP0344929

Funding Status
Closed

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Funded Activity Summary

Characterisation of soldered and adhesively bonded assemblies in photonic packages. Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability assessment. The outcomes of the project will fill the gap in the knowledge for characterising failure processes of these assemblies and provide effective methods and easy-to-use guidelines for reliability evaluation and life prediction of photonic packages, expanding and enhancing Australia's capacity in the areas.

Funded Activity Details

Start Date: 24-01-2003

End Date: 31-12-2008

Funding Scheme: Discovery Projects

Funding Amount: $449,000.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Mechanical Engineering | Communications Technologies | Interdisciplinary Engineering Not Elsewhere Classified | Optical And Photonic Systems

ANZSRC Socio-Economic Objective (SEO)

Metals (composites, coatings, bonding, etc.) | Communication equipment not elsewhere classified |

Other Keywords

Communication Not Elsewhere Classified | Communication equipment not elsewhere classified | Communications Technologies | Interdisciplinary Engineering Not Elsewhere Classified | Mechanical Engineering | Metals (composites, coatings, bonding, etc.) | Optical And Photonic Systems

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