Discovery Projects - Grant ID: DP0208896

Funding Activity

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Funded Activity Summary

A surface modification techniques for wafers of semiconductor materials. The research will develop an innovative technique for producing large wafers of semiconductor materials with a superfine surface finish. This technique will combine the advantages of ultra-precision grinding and polishing into a single operation. An effective superfinishing technique for the new generation of large-size wafers of semiconductor materials is essential because they are one of the most important materials for information technology, integrated circuit technology and fabrication of micro-machines.

Funded Activity Details

Start Date: 01-05-2002

End Date: 31-12-2002

Funding Scheme: Discovery Projects

Funding Amount: $40,000.00

Funder: Australian Research Council