Discovery Early Career Researcher Award - Grant ID: DE140100188

Funding Activity

Website
http://dataportal.arc.gov.au/NCGP/Web/Grant/Grant/DE140100188

Funding Status
Closed

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Funded Activity Summary

Understanding failure mechanisms in micro-solder joints in three dimensional integrated circuit packaging. High-density three-dimensional integrated circuits used in microelectronic devices are evolving and placing increasing demands on micro-solder joints. Tin based lead-free solder alloys require further development to satisfy performance requirements, particularly with respect to the properties of the intermetallic forms between solder and substrate. This project investigates the mechanical properties and deformation mechanisms of intermetallic forms with trace element additions using micro-pillar compression and ultra-high voltage transmission electron microscopy. Beyond the development of techniques transferable to similar research, this project will lead to significant intellectual property relating to solder composition.

Funded Activity Details

Start Date: 01-01-2014

End Date: 14-01-2017

Funding Scheme: Discovery Early Career Researcher Award

Funding Amount: $390,572.00

Funder: Australian Research Council

Research Topics

ANZSRC Field of Research (FoR)

Mechanical Engineering not elsewhere classified | Functional Materials | Materials Engineering | Metals and Alloy Materials

ANZSRC Socio-Economic Objective (SEO)

Expanding Knowledge in Engineering | Fabricated Metal Products not elsewhere classified | Expanding Knowledge in Technology |

Other Keywords

Expanding Knowledge in Engineering | Expanding Knowledge in Technology | Fabricated Metal Products not elsewhere classified | Functional Materials | Materials Engineering | Mechanical Engineering not elsewhere classified | Metals and Alloy Materials

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