Beyond the Ferroelectric Field Effect Transistors. The von Neumann paradigm is the foundation of modern computing systems, which are based on the data exchange between central processing unit (CPU) and memory. The physical separation between the CPU and memory will cause von Neumann bottleneck – a memory wall to limit the data processing speed for contextually intelligent applications. This project aims to develop a novel ferroelectric field effect transistor that integrates a ferroelectric mat ....Beyond the Ferroelectric Field Effect Transistors. The von Neumann paradigm is the foundation of modern computing systems, which are based on the data exchange between central processing unit (CPU) and memory. The physical separation between the CPU and memory will cause von Neumann bottleneck – a memory wall to limit the data processing speed for contextually intelligent applications. This project aims to develop a novel ferroelectric field effect transistor that integrates a ferroelectric material into a semiconductor transistor structure to merge logic and memory functionalities in a single-device level. This will solve the memory wall problem while provide low power, high speed, high density and long data retention time for future logic-in-memory and data centric computing paradigms.Read moreRead less
Wearable thermoelectrics for personal heat management. Thermoregulation has substantial implications for energy consumption and human comfort and health. This project aims to develop wearable thermoelectric materials and devices with high cooling performance for personal heat management. A novel assembly approach, coupled with device design and materials engineering strategies, will be developed to engineer flexible thermoelectric materials with unique structures and chemistry. The key breakthro ....Wearable thermoelectrics for personal heat management. Thermoregulation has substantial implications for energy consumption and human comfort and health. This project aims to develop wearable thermoelectric materials and devices with high cooling performance for personal heat management. A novel assembly approach, coupled with device design and materials engineering strategies, will be developed to engineer flexible thermoelectric materials with unique structures and chemistry. The key breakthrough is to design wearable thermoelectric devices with high flexibility and user comfort. The expected outcomes of this project will lead to an innovative cooling technology for personal heat management, which will place Australia at the forefront of wearable electronics and garment industry.Read moreRead less
High performance metal oxide inks for printable memory arrays . This project aims to develop next generation printable memory devices with low cost and excellent stability. The goal will be achieved by developing a new class of metal oxide nanomaterials based inks and large scale printing technology, through optimizing the synthesis, printing process and electrode configuration. The expected outcomes will be new electronic materials for a wide range of end uses in flexible electronics, significa ....High performance metal oxide inks for printable memory arrays . This project aims to develop next generation printable memory devices with low cost and excellent stability. The goal will be achieved by developing a new class of metal oxide nanomaterials based inks and large scale printing technology, through optimizing the synthesis, printing process and electrode configuration. The expected outcomes will be new electronic materials for a wide range of end uses in flexible electronics, significant advances in energy efficient data storage devices, and commercialisation of the technology to Australian industries.Read moreRead less
Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Towards high-performance wearable devices: materials and microfabrication. This project aims to design and develop functional nanomaterials and nanocomposites for high-performance wearable tactile sensors, integrating the sensors with nanogenerator and charge storage devices. In addition to the functional materials approach, precise control of device architecture through additive manufacturing and laser patterning will be implemented to maximise device performance. The expected outcomes of this ....Towards high-performance wearable devices: materials and microfabrication. This project aims to design and develop functional nanomaterials and nanocomposites for high-performance wearable tactile sensors, integrating the sensors with nanogenerator and charge storage devices. In addition to the functional materials approach, precise control of device architecture through additive manufacturing and laser patterning will be implemented to maximise device performance. The expected outcomes of this project include the detailed understanding of the nanomaterials structural-property relationship under constant mechanical stresses and establishing fundamental principle on the microfabrication of nano device wearable devices. This project will advance the field of materials chemistry and advanced manufacturing with niche high value-added products.Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
Discovery Early Career Researcher Award - Grant ID: DE190101152
Funder
Australian Research Council
Funding Amount
$404,000.00
Summary
Micro/nano-mechanical testing methodologies for interfacial adhesion. This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer in ....Micro/nano-mechanical testing methodologies for interfacial adhesion. This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer interfaces. This project will be a crucial enabler to accelerating the development of new flexible microelectronic technologies, from solar panels to electronic skin. This innovation will enable Australia to maintain an important connection to the rapidly-evolving international microelectronic industry and add significant value to Australian manufacturing industries.Read moreRead less
Discovery Early Career Researcher Award - Grant ID: DE210101162
Funder
Australian Research Council
Funding Amount
$395,000.00
Summary
Nanomanipulation of Liquid Metal Interfaces via Polyphenol Assembly. This project aims to explore natural polyphenols to functionalise liquid metal (such as gallium and its alloys) nanoparticles via a coordination-driven self-assembly process. This will advance our current understanding of the interfacial chemistry involved in liquid metal processing toward the synthesis of diverse functional systems. It is expected that such a unique combination will result in hybrid nanostructures possessing s ....Nanomanipulation of Liquid Metal Interfaces via Polyphenol Assembly. This project aims to explore natural polyphenols to functionalise liquid metal (such as gallium and its alloys) nanoparticles via a coordination-driven self-assembly process. This will advance our current understanding of the interfacial chemistry involved in liquid metal processing toward the synthesis of diverse functional systems. It is expected that such a unique combination will result in hybrid nanostructures possessing synergistic properties with potential applications in conductive surface patterning, toxic metal detection and solar steam generation. The developed strategies to manipulate liquid metal interfaces with ubiquitous natural compounds will lay the foundation for future investigations across diverse scientific disciplines.Read moreRead less
Epitaxial growth of III-V microring lasers for integrated silicon photonics. This project aims to investigate the growth and demonstration of compound semiconductor microring lasers on silicon substrates, using selective area growth to engineer the shape of the lasing cavity at the nano/micro-scale. Silicon photonics is currently a dominant technology in optical and data communication systems, and the continued development demands higher speeds, lower power consumption and lower costs. However, ....Epitaxial growth of III-V microring lasers for integrated silicon photonics. This project aims to investigate the growth and demonstration of compound semiconductor microring lasers on silicon substrates, using selective area growth to engineer the shape of the lasing cavity at the nano/micro-scale. Silicon photonics is currently a dominant technology in optical and data communication systems, and the continued development demands higher speeds, lower power consumption and lower costs. However, on-chip integrated, high efficiency lasers are still elusive due to mismatch in material platforms between the lasers and silicon substrates. This project will produce reliable, efficient and easily manufacturable laser sources integrated on silicon photonic chips. It is also expected to pave the way for more development of this technology by the industry to further drive the cost of silicon photonics technology down whilst increasing data transmission speed.Read moreRead less