Enhancing natural convection heat transfer using a single horizontal non-metallic fin. This project will develop the basis for a simple design to improve the energy efficiency of natural convection heat exchangers. Heat exchangers are widely adopted in many electronic devices and industrial processes as they require no external power input, additional space, and are quiet, reliable and economical. The research will exploit the interaction between two flows to trigger turbulence, and will result ....Enhancing natural convection heat transfer using a single horizontal non-metallic fin. This project will develop the basis for a simple design to improve the energy efficiency of natural convection heat exchangers. Heat exchangers are widely adopted in many electronic devices and industrial processes as they require no external power input, additional space, and are quiet, reliable and economical. The research will exploit the interaction between two flows to trigger turbulence, and will result in an increase of the overall capacity and performance of engineering systems. This will contribute significantly to reductions in power consumption and improvements in productivity and work environment, leading ultimately to reductions in greenhouse gas emissions and to economic benefits.Read moreRead less
Integrated Cooling Enhancement Technology for Power Electronics. This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop ....Integrated Cooling Enhancement Technology for Power Electronics. This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop fabrication processes for integrating microchannels and highly sensitive integrated silicon carbide temperature sensors into a chip. This novel fabrication technology allows for the implementation of the revolutionary enhanced cooling concept using two-phase flow with magnetic liquid plugs.Read moreRead less