Thixotropic Structure Generation and Semisolid Casting of Aluminium and Magnesium Alloys. A range of aluminium and magnesium alloys will be prepared by controlled-pouring to produce structures suitable for semisolid forming. The conditions around grain nucleation and growth will be studied to ascertain the controlling factors in producing suitable microstructures. A computer model to simulate the thixotropic structure formation and define the processing parameters will be developed. Semisolid c ....Thixotropic Structure Generation and Semisolid Casting of Aluminium and Magnesium Alloys. A range of aluminium and magnesium alloys will be prepared by controlled-pouring to produce structures suitable for semisolid forming. The conditions around grain nucleation and growth will be studied to ascertain the controlling factors in producing suitable microstructures. A computer model to simulate the thixotropic structure formation and define the processing parameters will be developed. Semisolid casting using the produced feedstock will lead to extensive knowledge about the effect of different microstructures and alloys on semisolid castability. Outcomes from the project will significantly advance the scientific understanding of the thixotropic structure generation and accelerate the development of semisolid processing technology.Read moreRead less
Discovery Early Career Researcher Award - Grant ID: DE190101152
Funder
Australian Research Council
Funding Amount
$404,000.00
Summary
Micro/nano-mechanical testing methodologies for interfacial adhesion. This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer in ....Micro/nano-mechanical testing methodologies for interfacial adhesion. This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer interfaces. This project will be a crucial enabler to accelerating the development of new flexible microelectronic technologies, from solar panels to electronic skin. This innovation will enable Australia to maintain an important connection to the rapidly-evolving international microelectronic industry and add significant value to Australian manufacturing industries.Read moreRead less