Digitally controlled mm-wave band selective devices and MEMS technology. This project aims to develop millimetre-wave frequency selective devices with programmable frequency response, using a silicon technology platform. It will design and make an entire radio system, including its tuneable antenna, at the wafer level. Wafer scale integration ensures the devices are compact and low cost, and can be inserted into smart watches for touchless gesture control, and minuscule devices, too small to be ....Digitally controlled mm-wave band selective devices and MEMS technology. This project aims to develop millimetre-wave frequency selective devices with programmable frequency response, using a silicon technology platform. It will design and make an entire radio system, including its tuneable antenna, at the wafer level. Wafer scale integration ensures the devices are compact and low cost, and can be inserted into smart watches for touchless gesture control, and minuscule devices, too small to be connected to the internet today. The project will demonstrate its devices in a wireless communication system operating at unprecedented data rates of over 100 Gb/s. These could transform terrestrial and satellite communication systems and propel Australia to the forefront of wireless communications.Read moreRead less
Discreet reading of printable multi-bit chipless radio frequency identification (RFID) tags on polymer banknotes. Counterfeiting of banknotes is a serious and costly world-wide problem, and very sophisticated measures are necessary to thwart counterfeiters. This project will use radio frequency identification techniques to enable bank tellers and other staff handling cash to discreetly check banknotes as they count them in front of customers.
Advanced microwave and millimetre-wave microelectromechanical technologies for wireless communications. The project deals with the development and integration of radio frequency microelectromechanical devices that can reduce space and cost concomitant with enhanced performance. The outcomes of this proposal are devices with increased functionality required for multi-gigabit data rate transmission and millimetre wave wireless technologies.
Micro-electro-mechanical Technologies and Tuneable Millimetre-wave Systems. The project aims to develop background theory and microelectromechanical (MEM)-based techniques for monolithic fabrication that integrate highly miniaturised three-dimensional waveguides with MEM systems. These technologies shall be used to design, develop and fabricate reconfigurable millimetre-wave devices. The project aims to bring together micromachining and millimetre-wave circuits to enable the realisation of recon ....Micro-electro-mechanical Technologies and Tuneable Millimetre-wave Systems. The project aims to develop background theory and microelectromechanical (MEM)-based techniques for monolithic fabrication that integrate highly miniaturised three-dimensional waveguides with MEM systems. These technologies shall be used to design, develop and fabricate reconfigurable millimetre-wave devices. The project aims to bring together micromachining and millimetre-wave circuits to enable the realisation of reconfigurable systems on chip. These technologies offer reduced size, cost and power consumption and high functionality, unachievable with conventional millimetre wave technology alone. The planned outcomes of the project are necessary to satisfy the sharply risen requirements for current and future fourth and fifth generation (4G and 5G) wireless communications systems.Read moreRead less
High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se ....High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.Read moreRead less
Circuit-based monitoring and characterisation of high performance semiconductor processes. As a frontier technology, this project extends Australia's leadership in wireless communications. Potentially this project provides the key enabling method for integrated circuits to take full advantage of future generations of semiconductor technology. National Research Priorities safeguarding Australia and promoting and maintaining good health will also be impacted through more capable circuits for def ....Circuit-based monitoring and characterisation of high performance semiconductor processes. As a frontier technology, this project extends Australia's leadership in wireless communications. Potentially this project provides the key enabling method for integrated circuits to take full advantage of future generations of semiconductor technology. National Research Priorities safeguarding Australia and promoting and maintaining good health will also be impacted through more capable circuits for defence electronics and anti-terrorism, medical remote sensing and networking. The innovations here will make Sapphicon, Australia's only commercial integrated circuit manufacturer, more competitive and indirectly benefit National ICT Australia (NICTA), Commonwealth Scientific and Industrial Research Organisation (CSIRO), Defence Science and Technology Organisation (DSTO), the National Broadband Network and a host of other high-performance electronics concerns.Read moreRead less
Complex magnetic structures for microwave, logic and memory applications. The proposed work addresses high profile fields of nanotechnology and frequency agile materials. Device prototypes of novel energy efficient components for microwave signal processing, for wave logic and for memory applications based on magnetic materials will be designed, fabricated and studied.