Foundations for Physically Unclonable nano-Security on Silicon. This project aims to develop an on-chip physical unclonable function (PUF) based on recent progress in nanotechnology to generate unprecedented number of unique signatures. This is significant because these signatures can be used for preventing fraud and counterfeiting, protecting sensitive data and securing communications. PUFs will play an extremely vital role in future security systems. The PUF in the proposed project will be sim ....Foundations for Physically Unclonable nano-Security on Silicon. This project aims to develop an on-chip physical unclonable function (PUF) based on recent progress in nanotechnology to generate unprecedented number of unique signatures. This is significant because these signatures can be used for preventing fraud and counterfeiting, protecting sensitive data and securing communications. PUFs will play an extremely vital role in future security systems. The PUF in the proposed project will be simple, fast, tiny, energy efficient and highly secure as a result of the abundant nano-fabrication variations. The outcome of this project will be a prototype of a super high secure nanoelectronic-based PUF that will be tested to evaluate the technology and its security against malicious attacks.Read moreRead less
Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The proje ....Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The project will use an open RISC-V processor which is sufficiently flexible to function as a base processor, with a myriad of tools such as compilers and debuggers available. Reliable computing machinery will enable systems to work in hostile environments and be functionally correct for longer.Read moreRead less
Bio-inspired Sniffer chips. This project will combine recent advances in neuroscience of olfaction, together with novel microelectronic fabrication technologies, to develop a miniature electronic nose microsystem with superior selectivity, stability, sensitivity and response time. Applications include national security, environment monitoring or medical diagnosis.
Band engineered heterostructures for next generation mercury cadmium telluride infrared photodetectors. The application of unique heterostructures in mercury cadmium telluride (HgCdTe) photodetectors is proposed to address at least four problems: increase of operating temperature, passivation, multiband operation, fill factor. This ambitious project will lead to a significant step forward the HgCdTe infrared photodetector physics and technology.
High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se ....High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.Read moreRead less
Adaptive multispectral imaging system for remote sensing applications. The many applications of remote sensing include environmental/crop monitoring, oil/mineral exploration, and aerospace/defence. However, remote sensing stands to benefit greatly from infrared spectral imaging devices. This project will develop the technology for an infrared spectral imaging system, suitable for numerous remote sensing applications.