Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
Towards energy-efficient lighting based on light-emitting diodes: the role of silicon carbide grown on Si Wafers. This project will investigate a potential solution to the problems of cost and quality of light-emitting diodes for solid-state lighting. The expected outcome is knowledge to underpin future development of solid-state lighting that is suitable for a wide replacement of the much less efficient and effective incandescent bulbs and fluorescent tubes.