Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily lif ....Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily life, as it will build the hardware foundation for the next generation of wireless systems. Consequently, various emerging applications such as virtual/augmented reality will be supported, maintaining national leadership in the development of wireless technology, and providing economic benefits for Australian industries.Read moreRead less
Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovere ....Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.Read moreRead less
Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of ....Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of manufacture to enable the next generation of chips. The project has potential to generate valuable intellectual property, support new processes and equipment for our partners, and help train the next generation of Australian researchers in the growing field of polymeric nanotechnology. Read moreRead less
Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The proje ....Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The project will use an open RISC-V processor which is sufficiently flexible to function as a base processor, with a myriad of tools such as compilers and debuggers available. Reliable computing machinery will enable systems to work in hostile environments and be functionally correct for longer.Read moreRead less
Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semico ....Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semiconductor chip fabrication facility, while UNSW has unparalleled cryogenic equipment and theoretical expertise for the study of electrons and holes in semiconductor devices. The outcomes will open up new routes to spin-based quantum computing based on holes. Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se ....High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.Read moreRead less