Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of ....Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of manufacture to enable the next generation of chips. The project has potential to generate valuable intellectual property, support new processes and equipment for our partners, and help train the next generation of Australian researchers in the growing field of polymeric nanotechnology. Read moreRead less
Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
High-brightness, low-efficiency roll-off materials for augmented realities. The proposal aims to apply new materials design theory to create new classes of highly efficient materials and overcome device efficiency roll-off issue for next-generation transparent electronics. The project expects to advance new see-through technology through new materials and device architectures innovations. Expected key outcomes include novel highly efficient multi-nuclear metal complexes generation, establishment ....High-brightness, low-efficiency roll-off materials for augmented realities. The proposal aims to apply new materials design theory to create new classes of highly efficient materials and overcome device efficiency roll-off issue for next-generation transparent electronics. The project expects to advance new see-through technology through new materials and device architectures innovations. Expected key outcomes include novel highly efficient multi-nuclear metal complexes generation, establishment of new knowledge of materials’ structure-property relationship and fundamental understanding of device physics, creation of new transparent display pixels, new training of young scientists and new IPs generation, which will provide benefits to maximise Australia's competitive advantages and meet with global innovation need.Read moreRead less