Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of ....Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of manufacture to enable the next generation of chips. The project has potential to generate valuable intellectual property, support new processes and equipment for our partners, and help train the next generation of Australian researchers in the growing field of polymeric nanotechnology. Read moreRead less
Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Linkage Infrastructure, Equipment And Facilities - Grant ID: LE210100126
Funder
Australian Research Council
Funding Amount
$527,638.00
Summary
Advanced Maskless Photolitography for Western Australia. This project aims to close an existing gap in micro- & nano-fabrication in Western Australia and provide access to advanced maskless photolithography in support of Australian research flagships of international excellence which include advanced infrared and quantum technologies, semiconductor optoelectronics, chemical engineering, microelectromechanical systems, as well as dark matter and gravitational wave discovery. Notably, the new capa ....Advanced Maskless Photolitography for Western Australia. This project aims to close an existing gap in micro- & nano-fabrication in Western Australia and provide access to advanced maskless photolithography in support of Australian research flagships of international excellence which include advanced infrared and quantum technologies, semiconductor optoelectronics, chemical engineering, microelectromechanical systems, as well as dark matter and gravitational wave discovery. Notably, the new capability is of utmost importance for five distinct ARC Centres in multidisciplinary areas and will be available to all researchers via the WA Node of Australian National Fabrication Facility in support of high impact scientific research and to maintain strong engagement with industry and Australian economy.Read moreRead less
Molecular Alignments in Organic Semiconductors. The proposed research project is focus on molecular alignments in solution-based organic semiconductors, which is at the frontier of research in the interdisciplinary field of plastic electronics. Molecular ordering has tremendous potential in enhancing both electrical and optical properties and opens up a way to realise new class of molecular electronic and optoelectronic devices. Significant learning from these devices can be applied to practical ....Molecular Alignments in Organic Semiconductors. The proposed research project is focus on molecular alignments in solution-based organic semiconductors, which is at the frontier of research in the interdisciplinary field of plastic electronics. Molecular ordering has tremendous potential in enhancing both electrical and optical properties and opens up a way to realise new class of molecular electronic and optoelectronic devices. Significant learning from these devices can be applied to practical high performance devices to be extremely cheap, recyclable, and mechanical flexible. Read moreRead less
Light Emitting Transistors: A New Route to Digital Displays and Lasers. This project intends to create new light-emitting display technology with the potential to offer much cheaper, recyclable, and mechanically flexible semiconductors. Organic light-emitting field effect transistors are an emerging class of integrated optoelectronic device with dual functionalities (ie a light emitting and a switch transistor in single device structure). The dual-functioned devices provide a promising pathway t ....Light Emitting Transistors: A New Route to Digital Displays and Lasers. This project intends to create new light-emitting display technology with the potential to offer much cheaper, recyclable, and mechanically flexible semiconductors. Organic light-emitting field effect transistors are an emerging class of integrated optoelectronic device with dual functionalities (ie a light emitting and a switch transistor in single device structure). The dual-functioned devices provide a promising pathway to much more economical display technologies and tunable organic lasers. The principal goal of this project is to develop a new route to achieve simplified display pixels and electrically pumped organic lasers by using organic light-emitting transistors platform with new organic chromophores. The new semiconductors could be easily integrated into a wide range of applications such as telecommunications, biomedical and consumer electronics.Read moreRead less
Organic-inorganic hybrid electronic devices and logic circuits. This project will create the next generation of opto-electronic devices and logic circuits using solution-based organic-inorganic hybrid materials with the potential to be extremely cheap, recyclable, and mechanically flexible. This project aims to position Australia as a leader in printed electronics.
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
Silicon-germanium-carbon - a novel opto-mechanic material for optical micro-electromechanical systems. Evolving from past black-and-white images, through present red-green-blue multi-spectral capability, future remote imaging systems promise spectroscopic functionality across much broader wavelength ranges in a low-cost system. However, the high cost of multiple materials and technologies for each specific spectral band limits them to high-cost industry sectors. This project proposes a simple, l ....Silicon-germanium-carbon - a novel opto-mechanic material for optical micro-electromechanical systems. Evolving from past black-and-white images, through present red-green-blue multi-spectral capability, future remote imaging systems promise spectroscopic functionality across much broader wavelength ranges in a low-cost system. However, the high cost of multiple materials and technologies for each specific spectral band limits them to high-cost industry sectors. This project proposes a simple, low-cost, single material technology based on silicon-germanium-carbon thin films for mechanical and optical applications from ultraviolet to long-wave infrared, enabling widespread application of spectroscopic imaging to multiple fields extending from climate change research, through resource exploration, to cancer detection, and aerospace/defense.Read moreRead less
Integrated Cooling Enhancement Technology for Power Electronics. This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop ....Integrated Cooling Enhancement Technology for Power Electronics. This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop fabrication processes for integrating microchannels and highly sensitive integrated silicon carbide temperature sensors into a chip. This novel fabrication technology allows for the implementation of the revolutionary enhanced cooling concept using two-phase flow with magnetic liquid plugs.Read moreRead less