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Socio-Economic Objective : National Security
Australian State/Territory : NSW
Research Topic : Microelectronics
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  • Funded Activity

    Discovery Projects - Grant ID: DP140103448

    Funder
    Australian Research Council
    Funding Amount
    $312,591.00
    Summary
    Foundations for Physically Unclonable nano-Security on Silicon. This project aims to develop an on-chip physical unclonable function (PUF) based on recent progress in nanotechnology to generate unprecedented number of unique signatures. This is significant because these signatures can be used for preventing fraud and counterfeiting, protecting sensitive data and securing communications. PUFs will play an extremely vital role in future security systems. The PUF in the proposed project will be sim .... Foundations for Physically Unclonable nano-Security on Silicon. This project aims to develop an on-chip physical unclonable function (PUF) based on recent progress in nanotechnology to generate unprecedented number of unique signatures. This is significant because these signatures can be used for preventing fraud and counterfeiting, protecting sensitive data and securing communications. PUFs will play an extremely vital role in future security systems. The PUF in the proposed project will be simple, fast, tiny, energy efficient and highly secure as a result of the abundant nano-fabrication variations. The outcome of this project will be a prototype of a super high secure nanoelectronic-based PUF that will be tested to evaluate the technology and its security against malicious attacks.
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    Active Funded Activity

    Discovery Projects - Grant ID: DP190103916

    Funder
    Australian Research Council
    Funding Amount
    $490,000.00
    Summary
    Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The proje .... Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The project will use an open RISC-V processor which is sufficiently flexible to function as a base processor, with a myriad of tools such as compilers and debuggers available. Reliable computing machinery will enable systems to work in hostile environments and be functionally correct for longer.
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    Active Funded Activity

    Linkage Projects - Grant ID: LP140100344

    Funder
    Australian Research Council
    Funding Amount
    $450,000.00
    Summary
    High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se .... High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.
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