Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily lif ....Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily life, as it will build the hardware foundation for the next generation of wireless systems. Consequently, various emerging applications such as virtual/augmented reality will be supported, maintaining national leadership in the development of wireless technology, and providing economic benefits for Australian industries.Read moreRead less
Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of ....Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of manufacture to enable the next generation of chips. The project has potential to generate valuable intellectual property, support new processes and equipment for our partners, and help train the next generation of Australian researchers in the growing field of polymeric nanotechnology. Read moreRead less
Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semico ....Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semiconductor chip fabrication facility, while UNSW has unparalleled cryogenic equipment and theoretical expertise for the study of electrons and holes in semiconductor devices. The outcomes will open up new routes to spin-based quantum computing based on holes. Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se ....High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.Read moreRead less
Photonic chip inertial movement sensors. This project aims to create a new class of optical inertial movement sensors using integrated photonic chip technology. By replacing optical fibre coils with compact waveguides, integrating light sources on-chip and by harnessing smart sensing approaches, we intend to reduce the required power from watts to milliwatts and reduce the dimensions from meters to centimetres. The expected project outcomes are sensors with military grade precision but with the ....Photonic chip inertial movement sensors. This project aims to create a new class of optical inertial movement sensors using integrated photonic chip technology. By replacing optical fibre coils with compact waveguides, integrating light sources on-chip and by harnessing smart sensing approaches, we intend to reduce the required power from watts to milliwatts and reduce the dimensions from meters to centimetres. The expected project outcomes are sensors with military grade precision but with the size, cost and manufacturability of consumer electronics. This technology will fill a strategic gap in the movement sensor market enabling applications ranging from robotic infrastructure monitoring, manufacture and surgery to guiding satellites and other space craft.Read moreRead less