Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
High-brightness, low-efficiency roll-off materials for augmented realities. The proposal aims to apply new materials design theory to create new classes of highly efficient materials and overcome device efficiency roll-off issue for next-generation transparent electronics. The project expects to advance new see-through technology through new materials and device architectures innovations. Expected key outcomes include novel highly efficient multi-nuclear metal complexes generation, establishment ....High-brightness, low-efficiency roll-off materials for augmented realities. The proposal aims to apply new materials design theory to create new classes of highly efficient materials and overcome device efficiency roll-off issue for next-generation transparent electronics. The project expects to advance new see-through technology through new materials and device architectures innovations. Expected key outcomes include novel highly efficient multi-nuclear metal complexes generation, establishment of new knowledge of materials’ structure-property relationship and fundamental understanding of device physics, creation of new transparent display pixels, new training of young scientists and new IPs generation, which will provide benefits to maximise Australia's competitive advantages and meet with global innovation need.Read moreRead less