Synthesis, characterisation, and applications of atomically thin layers of transition metal oxides and dichalcogenides. The project will explore the key fundamental properties of atomically-thin layers of functional materials made of transition metal oxides and dichalcogenides. By reducing the thickness of these materials to only a few atomic layers, the project will create novel electronic properties that are otherwise not exhibited. The aims are to understand layer-dependent changes to their p ....Synthesis, characterisation, and applications of atomically thin layers of transition metal oxides and dichalcogenides. The project will explore the key fundamental properties of atomically-thin layers of functional materials made of transition metal oxides and dichalcogenides. By reducing the thickness of these materials to only a few atomic layers, the project will create novel electronic properties that are otherwise not exhibited. The aims are to understand layer-dependent changes to their physical and chemical properties; to control and tune such properties by altering crystal structure and composition; and to investigate the effect of mixed-layer heterostructure configurations on these characteristics. The fundamental insights gained will serve as the driver for the next generation nanotechnology-enabled electronics and sensing systems.Read moreRead less
Diamond glass: An all-carbon technology for neural networks and biosensing. This project aims to use plasma deposition to synthesise diamond glass with the highest purity and the most diamond-like character so that it meets the strict requirements for emerging device applications. The extreme properties of diamond glass arise from the diamond-like bonding of the majority of its atoms. This amorphous, wide bandgap semiconductor is also the hardest known glass. The maximum diamond-like content pos ....Diamond glass: An all-carbon technology for neural networks and biosensing. This project aims to use plasma deposition to synthesise diamond glass with the highest purity and the most diamond-like character so that it meets the strict requirements for emerging device applications. The extreme properties of diamond glass arise from the diamond-like bonding of the majority of its atoms. This amorphous, wide bandgap semiconductor is also the hardest known glass. The maximum diamond-like content possible in diamond glass coatings is unknown, so determining its ultimate performance is difficult. Expected applications include medical diagnostics, non-volatile memories and programmable chips.Read moreRead less
Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Deformation and Adhesion of Thin Solid Films. Knowledge of the deformation mechanisms and adhesion of thin films on solid substrates is a major necessity for their mechanical property optimisation and commercialisation. The deformation mechanisms will be investigated by; 1) Nano-indentation with small spherical indenters, and 2) Transmission electron microscopy of focused ion beam milled cross-sections of such impressions. Adhesion will be evaluated using three techniques; 1) Tensile extension, ....Deformation and Adhesion of Thin Solid Films. Knowledge of the deformation mechanisms and adhesion of thin films on solid substrates is a major necessity for their mechanical property optimisation and commercialisation. The deformation mechanisms will be investigated by; 1) Nano-indentation with small spherical indenters, and 2) Transmission electron microscopy of focused ion beam milled cross-sections of such impressions. Adhesion will be evaluated using three techniques; 1) Tensile extension, 2) Nano-, and 3) Macro-indentation again with spherical indenters. In addition numerical modelling will compliment the observations of the film cracking and delamination about the impresion.Read moreRead less
Multilayer thin film memristors: designing interfaces and defect states in perovskites for nanoscale multi-state memories. This project will explore memristive devices, a frontier electronic memory technology, where the memory element's behaviour depends on its prior electronic experiences. This project will attempt to understand the processes that govern the storage and recall of information, to realise functional materials and interfaces that maximise memristive performance.
Discovery Early Career Researcher Award - Grant ID: DE160100023
Funder
Australian Research Council
Funding Amount
$330,000.00
Summary
Flexible transparent oxides – the future of electronics is clear. This project aims to support the development of flexible electronic devices incorporating the functional properties of oxide thin films. Oxide thin films require high processing temperatures, which are incompatible with flexible substrates. This project seeks to provide a solution by using a novel transfer process that allows oxides to be combined with flexible polymer substrates. Applications in sensing under the influence of hea ....Flexible transparent oxides – the future of electronics is clear. This project aims to support the development of flexible electronic devices incorporating the functional properties of oxide thin films. Oxide thin films require high processing temperatures, which are incompatible with flexible substrates. This project seeks to provide a solution by using a novel transfer process that allows oxides to be combined with flexible polymer substrates. Applications in sensing under the influence of heat, gas, and light will be studied. This project will potentially create devices that can be conformally applied to surfaces or worn on a person to act as low-cost sensors for toxic gases or ultraviolet radiation.Read moreRead less
A novel maskless process for patterning and doping of silicon. The outcomes of this research will have consequences for the semiconductor industry by providing the potential for a completely new process tool for patterning and doping in device and circuit fabrication. The technology is also applicable as a simple and inexpensive way to 'write' conducting and insulating regions in silicon and may thus be applicable for smart cards and small industry. Successful implementation of the research will ....A novel maskless process for patterning and doping of silicon. The outcomes of this research will have consequences for the semiconductor industry by providing the potential for a completely new process tool for patterning and doping in device and circuit fabrication. The technology is also applicable as a simple and inexpensive way to 'write' conducting and insulating regions in silicon and may thus be applicable for smart cards and small industry. Successful implementation of the research will raise Australia's international profile in this area. This work will be particularly beneficial to a new high-tech Australian company, WRiota, which specializes in device technology based in nanoindentation of silicon.Read moreRead less
Transistor-based sensor technology for fast, reliable and accurate in situ monitoring of recycled wastewater. Water recycling is becoming critical for water supplies worldwide, due to declining natural supplies of fresh water, combined with increasing demand. The greatest community and industry concerns over recycled water are quality assurance and relative cost. Ensuring quality requires monitoring of contaminants, yet no single real-time technology exists to measure the myriad of potential con ....Transistor-based sensor technology for fast, reliable and accurate in situ monitoring of recycled wastewater. Water recycling is becoming critical for water supplies worldwide, due to declining natural supplies of fresh water, combined with increasing demand. The greatest community and industry concerns over recycled water are quality assurance and relative cost. Ensuring quality requires monitoring of contaminants, yet no single real-time technology exists to measure the myriad of potential contaminants. This project will develop technology using AlGaN/GaN-based transistors, sensitised to different contaminants, enabling multi-analyte real-time sensor arrays. In situ monitoring systems based on such arrays will be fast, accurate, reliable, low-cost, and applicable to a broad variety of water recycling projects.Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less
Thin combinatorial films for heat management in microelectronics. This project aims to provide a viable solution for heat management in microelectronics by using highly efficient Peltier devices made with thin combinatorial films. Heat generated by electric current, which is ubiquitous in microelectronic devices, has become increasingly problematic for high density charge-based logical circuitries. The project will significantly enhance the energy conversion efficiency of Peltier devices by opti ....Thin combinatorial films for heat management in microelectronics. This project aims to provide a viable solution for heat management in microelectronics by using highly efficient Peltier devices made with thin combinatorial films. Heat generated by electric current, which is ubiquitous in microelectronic devices, has become increasingly problematic for high density charge-based logical circuitries. The project will significantly enhance the energy conversion efficiency of Peltier devices by optimising the interdependent electron and phonon transports, simultaneously, with a new concept of thin combinatorial films for heat management in microelectronic devices. This is expected to facilitate the development of novel materials in Australia, with access to a large global market.Read moreRead less