New multiplexed optical read-out technologies for micromachined cantilever sensor arrays. Passive sensing of chemical and biological agents is an essential capability in fields as diverse as national security, agriculture, mining and medicine. In many cases, generic sensing (e.g. are there pesticides present) as well as specific sensing (which pesticide) are both important. While sensors based on micro-electromechanical systems (MEMS) have shown extremely high performance at low cost, they have ....New multiplexed optical read-out technologies for micromachined cantilever sensor arrays. Passive sensing of chemical and biological agents is an essential capability in fields as diverse as national security, agriculture, mining and medicine. In many cases, generic sensing (e.g. are there pesticides present) as well as specific sensing (which pesticide) are both important. While sensors based on micro-electromechanical systems (MEMS) have shown extremely high performance at low cost, they have been limited to detection of a specific substance. Success in this project will make low cost generic MEMS-based sensors a reality, allowing, for the first time, wide-spread use of sensitive sensing systems in applications such as farming, container transport security, general medical practice and national security.Read moreRead less
Characterisation of soldered and adhesively bonded assemblies in photonic packages. Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability ....Characterisation of soldered and adhesively bonded assemblies in photonic packages. Photonic packaging plays key roles in development of new optical technology. The project aims to establish the theories and techniques for characterising the integrity of soldered and adhesively bonded assemblies for photonic packaging. The critical failure mechanisms will be investigated, and sophisticated life prediction models will be established using artificial neural network (ANN) approaches for reliability assessment. The outcomes of the project will fill the gap in the knowledge for characterising failure processes of these assemblies and provide effective methods and easy-to-use guidelines
for reliability evaluation and life prediction of photonic packages, expanding and enhancing Australia's capacity in the areas.
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