Mid-Career Industry Fellowships - Grant ID: IM230100079
Funder
Australian Research Council
Funding Amount
$1,019,275.00
Summary
Bio-inspired Sustainable Materials for Self-powered Environmental Sensing . This project aims to address the industry need for self-powered, light-weight and durable Internet of Things (IoT) devices for environmental sensing applications. The goal will be achieved by designing high power moisture-driven electric generators with a bi-layer interfacial architecture, developing non-flammable energy storage devices with cost-effective electrodes, and printing low power environmental sensors with he ....Bio-inspired Sustainable Materials for Self-powered Environmental Sensing . This project aims to address the industry need for self-powered, light-weight and durable Internet of Things (IoT) devices for environmental sensing applications. The goal will be achieved by designing high power moisture-driven electric generators with a bi-layer interfacial architecture, developing non-flammable energy storage devices with cost-effective electrodes, and printing low power environmental sensors with hetero-structured materials. The key outcome will be a new class of IoT devices with high power density, sustainable output, and real time environmental monitoring capabilities, that will directly benefit Australian industry by providing cost-effective, yet efficient ways to monitor and support safe working environments.Read moreRead less
Mid-Career Industry Fellowships - Grant ID: IM230100396
Funder
Australian Research Council
Funding Amount
$764,472.00
Summary
Scalable semiconductor quantum processor with flip chip bonding technology. Australia is famous for quantum computing research based on electron spin in silicon quantum dot. This project aims to enable the manufacturing of such scalable quantum processor. Currently, superconducting quantum processor has reached >100 of qubits by the utilization of 3D integration fabrication technology such as flip chip bonding. Likewise, for semiconductor spin-qubit to grow, it is inevitable that novel 3D archit ....Scalable semiconductor quantum processor with flip chip bonding technology. Australia is famous for quantum computing research based on electron spin in silicon quantum dot. This project aims to enable the manufacturing of such scalable quantum processor. Currently, superconducting quantum processor has reached >100 of qubits by the utilization of 3D integration fabrication technology such as flip chip bonding. Likewise, for semiconductor spin-qubit to grow, it is inevitable that novel 3D architecture by expanding the building block to the next dimension must be explored to pave the way to scalable semiconductor quantum processor. This project will spearhead Australia's semiconductor quantum processor to the realm of hundreds of qubits and put this technology on par with superconducting quantum processor.Read moreRead less