Photonic chip inertial movement sensors. This project aims to create a new class of optical inertial movement sensors using integrated photonic chip technology. By replacing optical fibre coils with compact waveguides, integrating light sources on-chip and by harnessing smart sensing approaches, we intend to reduce the required power from watts to milliwatts and reduce the dimensions from meters to centimetres. The expected project outcomes are sensors with military grade precision but with the ....Photonic chip inertial movement sensors. This project aims to create a new class of optical inertial movement sensors using integrated photonic chip technology. By replacing optical fibre coils with compact waveguides, integrating light sources on-chip and by harnessing smart sensing approaches, we intend to reduce the required power from watts to milliwatts and reduce the dimensions from meters to centimetres. The expected project outcomes are sensors with military grade precision but with the size, cost and manufacturability of consumer electronics. This technology will fill a strategic gap in the movement sensor market enabling applications ranging from robotic infrastructure monitoring, manufacture and surgery to guiding satellites and other space craft.Read moreRead less
High-brightness, low-efficiency roll-off materials for augmented realities. The proposal aims to apply new materials design theory to create new classes of highly efficient materials and overcome device efficiency roll-off issue for next-generation transparent electronics. The project expects to advance new see-through technology through new materials and device architectures innovations. Expected key outcomes include novel highly efficient multi-nuclear metal complexes generation, establishment ....High-brightness, low-efficiency roll-off materials for augmented realities. The proposal aims to apply new materials design theory to create new classes of highly efficient materials and overcome device efficiency roll-off issue for next-generation transparent electronics. The project expects to advance new see-through technology through new materials and device architectures innovations. Expected key outcomes include novel highly efficient multi-nuclear metal complexes generation, establishment of new knowledge of materials’ structure-property relationship and fundamental understanding of device physics, creation of new transparent display pixels, new training of young scientists and new IPs generation, which will provide benefits to maximise Australia's competitive advantages and meet with global innovation need.Read moreRead less
High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without se ....High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.Read moreRead less
Rainbows on demand: coherent comb sources on a photonic chip. This project aims to create photonic circuit technologies that will generate hundreds of coherent laser lines from a single chip. The emerging industrially scalable silicon nitride on thin-film lithium niobate platform will be advanced to create resonant modulators and nonlinear waveguides with unprecedented efficiency and innovative monitoring and control techniques. When combined, these components will enable highly flexible and rob ....Rainbows on demand: coherent comb sources on a photonic chip. This project aims to create photonic circuit technologies that will generate hundreds of coherent laser lines from a single chip. The emerging industrially scalable silicon nitride on thin-film lithium niobate platform will be advanced to create resonant modulators and nonlinear waveguides with unprecedented efficiency and innovative monitoring and control techniques. When combined, these components will enable highly flexible and robust systems for generating a comb of coherent laser lines. These photonic chip comb sources will be inexpensive, compact and energy efficient with transformative impact in spectroscopy, microscopy, precision measurement, quantum computing and ultra-fast optical fibre communications.Read moreRead less
Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The proje ....Design automation for secure, reliable and energy efficient embedded processors. This project seeks to create a methodology to design and generate processors which are both secure, reliable and energy efficient for deployment in Internet of Things (IoT) systems, which require little on-going maintenance. In such systems, both security and reliability are paramount, particularly in medical devices, control devices in critical machinery, financial transactions and automotive electronics. The project will use an open RISC-V processor which is sufficiently flexible to function as a base processor, with a myriad of tools such as compilers and debuggers available. Reliable computing machinery will enable systems to work in hostile environments and be functionally correct for longer.Read moreRead less
Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semico ....Developing hole spin quantum bits in industrially fabricated silicon chips. This is a joint proposal to combine IMEC’s technology and facilities for silicon chip fabrication with UNSW’s expertise in quantum devices to optimise the design and fabrication techniques used to manufacture silicon based hole spin qubits on an industrial scale in a full 300mm wafer fabrication line. IMEC is a world-leading research and innovation hub in nanoelectronics and digital technologies, with a €1billion semiconductor chip fabrication facility, while UNSW has unparalleled cryogenic equipment and theoretical expertise for the study of electrons and holes in semiconductor devices. The outcomes will open up new routes to spin-based quantum computing based on holes. Read moreRead less
Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. Thi ....Intermetallic compounds for high reliability electronic interconnections. The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.Read moreRead less
Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include red ....Next generation flexible high current micro-electronic interconnects. The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.Read moreRead less