Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily lif ....Digitally Assisted Power Amplifier Design with Enhanced Energy Efficiency. The project aims to advance design techniques for power amplifiers operating in the recently allocated spectrum for 5G New Radio, from approximately 24 GHz to 52 GHz. The intended outcome is a compact and high efficiency transmitter using digitally assisted power amplifier design techniques in low-cost Complementary Metal–Oxide–Semiconductor (CMOS) technology. Such innovation will have significant impacts on our daily life, as it will build the hardware foundation for the next generation of wireless systems. Consequently, various emerging applications such as virtual/augmented reality will be supported, maintaining national leadership in the development of wireless technology, and providing economic benefits for Australian industries.Read moreRead less
Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of ....Innovative Double Patterning Strategies for Integrated Circuit Manufacture. The global computer chips industry is predicted to be worth in excess of 1.5 trillion USD by 2030. Despite its success, the industry is under threat due to rising costs of manufacture of the latest chips, in large part because of the complexity of the manufacturing process. This project aims to introduce new polymers for production of computer chips and, in collaboration with our industry partner, develop new methods of manufacture to enable the next generation of chips. The project has potential to generate valuable intellectual property, support new processes and equipment for our partners, and help train the next generation of Australian researchers in the growing field of polymeric nanotechnology. Read moreRead less
Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovere ....Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.Read moreRead less