Non-destructive characterisation of residual stresses for the silicon-on-sapphire technology. Every sapphire wafer for the fabrication of integrated circuits using the silicon-on-sapphire technology is worth more than a thousand dollars, and the cost grows exponentially with successive processing of circuitry. Early detection and prevention of wafer failure is therefore an economic and quality necessity. The fast, non-destructive method to be developed by the proposed research will enable semic ....Non-destructive characterisation of residual stresses for the silicon-on-sapphire technology. Every sapphire wafer for the fabrication of integrated circuits using the silicon-on-sapphire technology is worth more than a thousand dollars, and the cost grows exponentially with successive processing of circuitry. Early detection and prevention of wafer failure is therefore an economic and quality necessity. The fast, non-destructive method to be developed by the proposed research will enable semiconductor electronics manufacturers to achieve a cost-effective fabrication of integrated circuits by detecting damages in wafers at the very early stage of production.Read moreRead less
Nano/micro grinding mechanisms and technologies for brittle materials. The successful completion of the project will solve a long standing problem, that is, the ductile removal mechanism in the machining of brittle materials and create a strong knowledge base for the development of technology and characterization techniques for nano/micro mechanical machining of such materials. This will strengthen UWA's research capability and international competitiveness in the field of nano/micro manufacturi ....Nano/micro grinding mechanisms and technologies for brittle materials. The successful completion of the project will solve a long standing problem, that is, the ductile removal mechanism in the machining of brittle materials and create a strong knowledge base for the development of technology and characterization techniques for nano/micro mechanical machining of such materials. This will strengthen UWA's research capability and international competitiveness in the field of nano/micro manufacturing. The pragmatic grinding technology developed for fabricating micro aspherical mould inserts and lenses will directly benefit the optics/photonics, microelectronics and biomedical industries in Australia. This will help to position Australia in the forefront of emerging industries in the new millenniumRead moreRead less