Deformation and Adhesion of Thin Solid Films. Knowledge of the deformation mechanisms and adhesion of thin films on solid substrates is a major necessity for their mechanical property optimisation and commercialisation. The deformation mechanisms will be investigated by; 1) Nano-indentation with small spherical indenters, and 2) Transmission electron microscopy of focused ion beam milled cross-sections of such impressions. Adhesion will be evaluated using three techniques; 1) Tensile extension, ....Deformation and Adhesion of Thin Solid Films. Knowledge of the deformation mechanisms and adhesion of thin films on solid substrates is a major necessity for their mechanical property optimisation and commercialisation. The deformation mechanisms will be investigated by; 1) Nano-indentation with small spherical indenters, and 2) Transmission electron microscopy of focused ion beam milled cross-sections of such impressions. Adhesion will be evaluated using three techniques; 1) Tensile extension, 2) Nano-, and 3) Macro-indentation again with spherical indenters. In addition numerical modelling will compliment the observations of the film cracking and delamination about the impresion.Read moreRead less
A novel maskless process for patterning and doping of silicon. The outcomes of this research will have consequences for the semiconductor industry by providing the potential for a completely new process tool for patterning and doping in device and circuit fabrication. The technology is also applicable as a simple and inexpensive way to 'write' conducting and insulating regions in silicon and may thus be applicable for smart cards and small industry. Successful implementation of the research will ....A novel maskless process for patterning and doping of silicon. The outcomes of this research will have consequences for the semiconductor industry by providing the potential for a completely new process tool for patterning and doping in device and circuit fabrication. The technology is also applicable as a simple and inexpensive way to 'write' conducting and insulating regions in silicon and may thus be applicable for smart cards and small industry. Successful implementation of the research will raise Australia's international profile in this area. This work will be particularly beneficial to a new high-tech Australian company, WRiota, which specializes in device technology based in nanoindentation of silicon.Read moreRead less